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DESCRIPTION |
DATA SHEET PDF |
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RF Test Sockets w/Replaceable
Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the
DUT board and become part of the transmission line. Self-inductance as low as
0.01nH and Frequency Response to 19GHz.
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AN “INSTA-QUOTE” |
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Thermoelectric-cooled RF
Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric
cooler (TEC) provides fast and accurate temperature control, while the built-in
epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing
of ±0.02°C.
GET
AN “INSTA-QUOTE” |
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High-Frequency Interposer
Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives
you the High-frequency characteristics of our Microstrip™ Contact Socket
combined with the close component placement of our Spring Probe Sockets. Signal
paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical
to the package footprint.
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AN “INSTA-QUOTE” |
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High-Frequency Center Probe™ Test
Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and
Flash devices on any pitch of 0.40mm pitch or higher. This socket is easily mounted
and removed to & from the PCB due to solderless pressure-mount compression
spring probes.
GET
AN “INSTA-QUOTE” |
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High-Frequency Center Probe™ Test
Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of
probes will work for any application. Available pitches down to 0.5mm with Frequency
Response over 10GHz!
GET
AN “INSTA-QUOTE” |
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High-Frequency
Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm
Square |
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Machined High-Frequency Center
Probe Test Socket for BGA, CSP & MLF Packages
Our answer for a reliable Area Array Package socket. Our unique style of
probes will work for any application. Available pitches down to 0.5mm with Frequency
Response over 10GHz!
GET
AN “INSTA-QUOTE” |
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High-Frequency Center Probe™ Test
Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM,
DRAM and Flash Devices on any pitch device on 0.40mm or larger. The 4-point Crown
insures “scrub” on solder oxides.
GET
AN “INSTA-QUOTE” |
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High-Frequency Center Probe™ Test
Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices
on any pitch of 0.50mm or larger. The four-point crown insures “scrubbing” of
solder oxides, while pointed probe works with LGA’s, MLF’s, etc.
GET
AN “INSTA-QUOTE” |
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| LOADBOARD
DESIGN GUIDELINES |
NEW
TRENDS IN SOCKETS WEBCAST
Originally broadcast October 6, 2005, featuring Aries Electronics’ own
RF Product Manager Bruce DeChillo. This Webinar will cover Lead-free Socket specifics,
High-performance Sockets, Low-contact Resistance Sockets, and Sockets – all
from a business perspective. |
RF CENTER PROBE™ CONTACT
Signal Path Length: as short as 0.077"
Operating Temperature: -55°C to +150°C
Insertions: >500,000
Self-Inductance: 0.51nH
Bandwidth: 18.0GHz at -1dB (0.5mm pitch)
Contact Resistance: <70 milliohms |
RF MICROSTRIP™ CONTACT
Signal Path Length: 0.005" and 0.007"
Operating Temperature: -55°C to +150°C
Insertions: 500,000
Self-Inductance: 0.01nH
Bandwidth: 16GHz at -1dB (0.50mm pitch)
Contact Resistance: <70 milliohms |
RF INTERPOSER
Signal Path Length: as short as 0.011"
Operating Temperature: -55°C to +150°C
Insertions: >50,000
Self-Inductance: 0.09nH
Bandwidth: 40GHz at -1dB
Contact Resistance: <40 milliohms |
RF CENTER PROBE™ PinBall™
Signal Path Length:
1) 0.139" (3.5mm) for 0.50mm and 0.65mm pitch
2) 0.202" (0.51mm) for 0.80mm pitch and higher
Operating Temperature: -55°C to +150°C
Insertions: >10,000
Contact Resistance: <60 milliohms |