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高频（RF）测试插座

Chinese Version of Aries High-Frequency (RF) Sockets

English Version
  描述
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RF MicroStrip™

RF可更换接触Pad测试插座
这种测试插座采用Aries专利的Microstrip™接触。这种设计可以使探针平整的和DUT板接触，并成为通路的一部分。探针自感仅有0.01nH，最高响应频率为19GHz

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Thermoelectric-cooled RF Test Socket

热电制冷RF测试插座
测试插座得改采用Peltier技术。热电制冷器可以实现对温度实时而准确的监控，热敏电阻的灵敏度为±0.02°C。热敏电阻用环氧树脂包裹，并固定。

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High-Frequency Interposer Socket

可选插入式高频插座
这将是一个两全其美的选择！这种插座在设计上采用了Aries专利Microstrip™技术的同时，还融合了我们弹簧顶针插座元件紧凑放置的设计。因为插座引出部分焊盘和器件的引脚Footprint相同，信号通道仅为0.008" [0.203mm]

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High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square
High-Frequency Center Probe Test Socket for Devices up to 13mm Square

采用Center Probe™专利技术适用于器件面积小于13mm的高频测试插座
适用于pitch大于0.40mm CSP, µBGA, DSP, LGA, SRAM, DRAM，Flash器件的测试和动态老化。由于采用了无焊接，弹簧探针压力固定的办法，所以插座可以非常简便的安装到和从PCB上移除。

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High-Frequency Center Probe Test Socket for Devices from 14 to 27mm Square

采用Center Probe™专利技术适用于器件面积在13到27mm的高频测试插座
这是一款Aries提供的面阵封装器件的可靠性测试插座。Aries的探针设计适用于所有的应用。适合pitch大于0.5mm的任何器件，并且最高响应频率大于10GHz.

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High-Frequency Center Probe™ Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
 采用Center Probe™专利技术并且带有可调压力垫的高频测试插座，适用于封装面积在小于27mm的器件
Machined High-Frequency Center Probe Test Socket for BGA, CSP & MLF Packages

机械加工的采用Center Probe™专利技术的测试插座，适用于BGA, CSP & MLF封装
这是一款Aries提供的面阵封装器件的可靠性测试插座。Aries的探针设计适用于所有的应用。适合pitch大于0.5mm的任何器件，并且最高响应频率大于10GHz.

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High-Frequency Center Proce Test Socket for Devices up to 40mm Square

采用Center Probe™专利技术适用于器件面积小于40mm的高频测试插座
适用于pitch大于0.40mm CSP, µBGA, DSP, LGA, SRAM, DRAM，Flash器件的高频测试和老化。探针的皇冠头设计可以有效的去除焊锡氧化物。

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High-Frequency Center Probe Test Socket for Devices up to 55mm Square

采用Center Probe™专利技术适用于器件面积小于55mm的高频测试插座
适用于pitch大于0.50mm CSP, µBGA, DSP, LGA, SRAM, DRAM，Flash器件的高频测试和老化。当被测件为LGA’s, MLF’s封装时，探针的皇冠头设计可以有效的去除焊锡氧化物

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Kelvin Test Socket

 
   
   
   
LOADBOARD DESIGN GUIDELINES

NEW TRENDS IN SOCKETS WEBCAST

Originally broadcast October 6, 2005, featuring Aries Electronics’ own RF Product Manager Bruce DeChillo. This Webinar will cover lead-free Socket specifics, High-performance Sockets, Low-contact Resistance Sockets, and Sockets – all from a business perspective.
RF CENTER PROBE™ CONTACT
Signal Path Length: as short as 0.077"
Operating Temperature: -55°C to +150°C
Insertions: >500,000
Self-Inductance: 0.51nH
Bandwidth: 18.0GHz at -1dB (0.5mm pitch)
Contact Resistance: <70 milliohms		 RF MICROSTRIP™ CONTACT
Signal Path Length: 0.005" and 0.007"
Operating Temperature: -55°C to +150°C
Insertions: 500,000
Self-Inductance: 0.01nH
Bandwidth: 16GHz at -1dB (0.50mm pitch)
Contact Resistance: <70 milliohms
RF INTERPOSER
Signal Path Length: as short as 0.011"
Operating Temperature: -55°C to +150°C
Insertions: >50,000
Self-Inductance: 0.09nH
Bandwidth: 40GHz at -1dB
Contact Resistance: <40 milliohms		 RF CENTER PROBE™ PinBall™
Signal Path Length:
1) 0.139" (3.5mm) for 0.50mm and 0.65mm pitch
2) 0.202" (0.51mm) for 0.80mm pitch and higher
Operating Temperature: -55°C to +150°C
Insertions: >10,000
Contact Resistance: <60 milliohms