Series X55X High-Temperature Universal ZIF (Zero-Insertion-Force) DIP Test Socket
ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Aries’ Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers.
- All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] centers.
- Contacts are normally closed to eliminate dependence on plastic to sustain contact.
- Socket handle can be configured with closed contacts (on) when in the UP or DOWN position, and can be mounted on either the right or left side.
- Sockets can be soldered into PCBs. Socket fits into Aries’ test socket receptacle on Data Sheet 10003.
GENERAL SPECIFICATIONS
- Socket Body: natural UL 94 V-0 Glass-filled Polyetheretherketone (PEEK)
- Handle: Stainless Steel
- Contacts: Beryllium-Nickel 360, 1/2-hard
- Contact Plating: 50µ [1.27µ] Nickel-Boron
- Contact Current Rating: 1 amp
- Operating Temperature: minimum -67°F [-55°C], maximum 482°F [250°C]
- Retention Force (when closed): 55g/pin based on 0.020 [0.51] diameter test lead
- Insulation Resistance: 1000 MOhms minimum
- Dielectric Withstanding Voltage: 1000VAC
- Life Cycle: 25,000 to 50,000 cycles
- Accepts Leads: 0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long
- Socket fits Aries’ Series 6556 Test Socket Receptacle. Consult Data Sheet 10003
MOUNTING CONSIDERATIONS
- See Socket Footprint below
- DO NOT LEAVE THE SOCKET ON THE “CONTACT OPEN” OR “OFF POSITION” WHILE UNDER TEMPERATURE IN THE BURN-IN OVEN.
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Download Data
Sheet 10002, Rev H |





