Series 647 Universal SOIC-to-DIP 0.600 [15.24] Adapter |
![Series 647 Universal SOIC-to-DIP 0.600 [15.24] Adaptor](10016_adaptor.jpg)
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.FEATURES
- 44-pin Adapter for mounting Aries Series 547 Universal SOIC ZIF Test Socket to 0.600 [15.24] DIP PCB layout.
- Consult Data Sheet 10015 for test socket information.
GENERAL SPECIFICATIONS
- BODY MATERIAL: black 0.062 [1.58] thick FR-4 or IS410 per IPCA4101A/26, 0.094 [2.39] thick, with 1-oz. min. Cu traces
- FEMALE PIN BODY: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- FEMALE PIN BODY PLATING: 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
- 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM-B194-01
- COLLET CONTACT PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni per SAE AMS-QQ-N-290B
- MALE PIN: Phosphor Bronze 544 UNS C5400 ASTMB139-90
- MALE PIN PLATING: 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
- COLLET CONTACT CURRENT RATING: 3 amps
- OPERATING TEMPERATURE: 221°F [105°C]
- INSERTION FORCE: 180g/pin; based on a 0.018 [0.46] dia. test lead
- WITHDRAWAL FORCE: 90g/pin; based on a 0.018 [0.46] dia. test lead
MOUNTING CONSIDERATIONS
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.002 [0.71 ±0.05] dia.
| NOTICE | ORDERING INFORMATION | |
ALL DIMENSIONS IN INCHES [MILLIMETERS] ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
![]() |
Download Data
Sheet
10016,
Rev AA |



![Reference-Only Drawing for Series 647 Universal SOIC-to-DIP 0.600 [15.24] Adaptor](10016_dwg.jpg)

