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Series X57X Quick-Release Universal ZIF (Zero-Insertion-Force) DIP Test Socket

Series X57X – Quick-Release Universal Zero-Insertion-Force (ZIF) DIP Test Socket ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Aries’ Universal Test Socket accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers.
  • All pin count sockets go into PCB with either 0.300 or 0.600 [7.62 to 15.24] centers.
  • Swing quick-release handle down to open contacts and insert device. Release and handle automatically returns as contacts close onto device leads.
  • Socket handle can be mounted on either the right or left side.
  • Sockets can be soldered into PCBs or plugged into any socket.

GENERAL SPECIFICATIONS

  • Standard Socket Body: (-10, -10TL, -11, -16 sockets) black UL 94 V-0 Glass-filled Polyphenylene Sulfide (PPS)
  • High-temperature Socket Body: (-18 sockets) are natural color Polyetheretherketone (PEEK)
  • Handle: Stainless Steel
  • Handle Knob Brass alloy 360 1/2-hard (no knob on loop handle)
  • Contact: (-10, -10TL, -11) Beryllium-Copper alloy 172 per QQ-C-553. (-16) Spinodal alloy (-18) Beryllium-Nickel alloy 360, 1/2-hard
  • All Beryllium-Copper Contacts: 50µ [1.27µ] min. Nickel underplate per QQ-N-290, overplated with either (-10) 200µ [5.08µ] min. matte Tin per ASTM B545-97(2004)e1 (-10TL) 200µ [5.08µ] min. 90/10 Tin/Lead per MIL-T-10727 (-11) 10µ [0.25µ] min. Gold per MIL-G-45204
  • Spinodal Contact Plating: (-16) 50µ [1.27µ] min. Nickel Boron
  • Hi-temperature Beryllium-Nickel Contact Plating: (-18) 50µ [1.27µ] Nickel-Boron
  • Contact Current Rating: 1 amp
  • Insulation Resistance: 1000 MOhms minimum
  • Dielectric Withstanding Voltage: 1000VAC
  • Life Cycle 25,000 to 50,000 Cycles
  • Operating Temperature: minimum -67°F [-55°C] maximum 221°F [105°C] for Tin plating, 302°F [150°C] for Gold plating, 392°F [200°C] for Nickel-Boron plating, 482°F [250°C] for high-temperature socket
  • Retention Force (when closed): 55g/pin based on 0.020 [0.51] diameter test lead
  • Accepts Leads: 0.015-0.035 [0.38-0.89] wide, 0.110-0.280 [2.79-7.11] long

MOUNTING CONSIDERATIONS

  • See Socket Footprint below

 

NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

 

 

 

 

 

* Only Loop Handle Available w/High-Temp Socket

Socket fits Aries’ Test Socket Receptacles P/N XX-6556-XX or similar competitors’ models. Consult Data Sheet 10003.

 

Reference-Only Drawing for Series X57X – Quick-Release Universal Zero-Insertion-Force (ZIF) DIP Test Socket
Handle
Dim. “H1”
Dim. “H2”
Dim. “H3”
Long
w/knob
0.568 [14.43]
0.471 [11.96]
0.760 [19.30]
Short
w/knob
0.317 [8.05]
0.252 [6.40]
0.435 [11.05]
Loop
w/o knob
0.270 [6.86]
0.193 [4.90]
0.405 [10.29]

 

Download Data Sheet 10019, Rev G