Series C84/93 Lo-PRO®file Dual-Beam Solder Tail Edge-Grip™ Socket
ARIES
SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS
SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN
BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Anti-wicking design on Lo-PRO®file sockets eliminates flux or solder contamination.
- Dual-beam, Edge-Grip™ contacts provide high retention and positive contact.
- End-to-end and side-to-side stackable.
GENERAL SPECIFICATIONS
- Body black UL 94 V-0 Glass-filled Nylon 4/6
- Dual-beam Contact Phosphor Bronze alloy 521
- Contact Plating (overall) 50µ [1.27µ] Nickel per SAE-AMS-QQ-N-290); Tin 200µ [5.08µ] min. matte Tin per ASTM B545-97(2004)e1; Tin/Lead 100-150µ [2.54-3.81µ] min. 90/10 Tin/Lead per MIL-P-81728; Gold 10µ [0.25µ] min. Gold per MIL-G-45204 in contact area and 100-150µ [2.54-3.81µ] min 90/10 Tin/Lead per MIL-P-81728 on Solder Tail
- Wafer Nomex, 0.005 [0.13] thick
- Contact Current Rating 1 amp
- Contact Resistance 20 mOhms (initial)
- Insulation Resistance 100 MOhms at 500VDC per MIL-STD-1344, Method 3003.1
- Dielectric Withstanding Voltage 1000VAC
- Operating Temperature -67°F to 221°F [-55°C to 105°C] Tin ; -67°F to 257°F [-55°C to 125°C] Gold
- Accepts Leads up to 0.011 x 0.018 ±0.003 [0.28 x 0.46 ±0.08] or 0.021 [0.53] dia., 0.070-0.135 [1.78-3.43] long
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.036 ±0.002 [0.91 ±0.05] diameter
| NOTICE | ORDERING INFORMATION | |||
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Download Data Sheet 12001, Rev E |





