EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Surface Mount Pins
ARIES
SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS
SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN
BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance.
- The latch locks in the connector or device, making it ideal for high vibration environments.
- The latch, when used as an ejector, removes DIP packages without pin damage.
- High-temperature 4/6 Nylon suitable for virtually any surface-mount soldering application.
GENERAL SPECIFICATIONS
- Latch and body are black UL 94V-0 Glass-filled 4/6 Nylon
- Pin body is Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
- Pin body plating is either 10µ" [0.25µm] min. Gold per MIL-G-45204 or 200µ" [5.08µm] min. 93/7 Tin/Lead per ASTM B545 or 200µ" [5.08µm] min Tin per ASTM B545 Type 1 over 100µ" [2.54µm] min. Nickel per SAEAMS- QQ-N-290
- 6-fingered collet contact is Beryllium-Copper Alloy per UNS C17200 ASTM-B194-01
- Contact plating is 10µ" [0.25µm] min. Gold per MIL-G-45204 over 50µ" [1.27µm] min. Nickel per SAE-AMS-QQ-N-290. Heavy 30µ" [0.76µm] Gold plating on contact also available
- Contact current rating 3 Amps
- Insulation resistance 10,000 MOhms @ 500 VDC
- Withstanding voltage 1000 V RMS
- Operating temp. -67°F to 221°F [-55°C to 105°C] Tin plating, -67°F to 257°F [-55°C to 125°C] Gold
- Insertion Force: 67g/pin; Withdrawal Force: 30g/pin; Normal Force: 45g/pin; based on 0.018 [0.46] dia. test lead
MOUNTING CONSIDERATIONS
- Suggested PCB Pad size 0.063 [1.60] diameter
| NOTICE | ORDERING INFORMATION | |
![]() |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Download Data Sheet 12023, Rev D |





