EJECT-A-DIP™ Lock/Eject DIP Collet Socket with Wire Wrap Pins
ARIES
SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS
SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN
BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Eject-A-DIP™ is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance.
- The latch locks in the connector or device, making it ideal for high-vibration environments.
- The latch, when used as an ejector, removes DIP packages without pin damage.
GENERAL SPECIFICATIONS
- Latch and Body black UL 94 V-0 Glass-filled 4/6 Nylon
- Pin Body Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
- Pin Body Plating either 10µ [0.25µ] min. Gold per MIL-G-45204 or 200µ [5.08µ] min. 93/7 Tin/Lead per ASTM B545 or 200µ [5.08µ] min. Tin per ASTM B545 Type 1 over 100µ [2.54µ] min. Nickel per SAE-AMS-QQ-N-290
- 6-fingered Collet Contact Beryllium-Copper alloy per UNS C17200 ASTM B194-01
- Contact Plating 30µ [0.76µ] min. Gold per MIL-G-45204 over 50µ [1.27µ] min. Nickel per SAE-AMS-QQ-N-290
- Contact Current Rating 3 amps
- Insulation Resistance 10,000 MOhms at 500VDC
- Withstanding Voltage 1000Vrms
- Operating Temperature -67°F to 221°F [-55°C to 105°C] Tin plating; -67°F to257°F [-55°C to 125°C] Gold
- Insertion Force 67g/pin; Withdrawal Force 30g/pin; Normal Force 45g/pin; based on 0.018 [0.46] dia. Test Lead
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.045 ±0.002 [1.15 ±0.05] diameter
| NOTICE | ORDERING INFORMATION | |
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Download Data Sheet 12025, Rev E |





