Series 350000-10-HT High-Temperature SOIC DIP Adaptor

ARIES
SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS
SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN
BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout.
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adaptors on 0.400 [10.16] or 0.600 [15.24] centers.
GENERAL SPECIFICATIONS
- Board material 0.062 thick Polyimid, Tg 260°C with 1-oz Copper traces, both sides
- Pads Finished with White Tin
- Pins Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
- Pin Plating 200µ [5.08µ] min. Tin per ASTM B545 over 100µ [2.54µ] Nickel per SEA-AMS-QQ-N-290
- Operating Temperature 200°C maximum
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
| NOTICE | ORDERING INFORMATION | |
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18005, Rev I |




