
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 350000-10-HT
High-Temperature
SOIC-to-DIP Adapter
FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16], or 0.600 [15.24] centers
GENERAL SPECIFICATIONS
- BOARD MATERIAL: 0.062 [1.58] thick Polyimide, Tg 260°C with 1-oz. Cu traces, both sides
- PADS: finished with white Sn
- PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
- OPERATING TEMPERATURE: 200°C max.
MOUNTING CONSIDERATIONS
SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
| NOTICE | ORDERING INFORMATION | |
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED “A” = NO. OF PINS PER ROW x 0.100 [2.54] AVAILABLE IN PANELIZED FORM WITH OR WITHOUT CUSTOMER-SUPPLIED DEVICES MOUNTED. CONSULT FACTORY CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18005, Rev AA |





