Series 354000 DIP-to-SOIC Adaptor

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts.
GENERAL SPECIFICATIONS
- Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp
- PCB is FR-4, 0.062 [1.58] thick
- Male adapter pin is Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
- Male pin plating is 200µ" [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100µ" [2.54µm] Nickel per SAE-AMS-QQ-N-290
- Female contact pin is Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
- Female pin plating is 10µ" [0.254µm] min. Gold per MIL-G-45204 over 100µ" [2.54µm] min. Nickel per SAE-AMS-QQ-N-290
- 4-fingered collet contact is Beryllium-Copper Alloy per UNS C17200 ASTM-B194-01
- Female contact plating is 10µ" [0.254µm] min. Gold per MIL-G- 45204 over 50µ" [1.27µm] min. Nickel per SAE-AMS-QQ-N- 290
- Contact current rating = 3 Amps
- Operating temperature = 221°F [105°C]
- Insertion Force = 180 grams/pin; Withdrawal Force = 90 grams/pin; Normal Force = 140 grams/pin; based on a 0.018 [0.46] diameter test lead
- Socket accepts leads 0.015-0.025 [0.38-0.64] in diameter, 0.100-0.125 [2.54-3.18] long
MOUNTING CONSIDERATIONS
- Suggested PCB Solder Pad size 0.028 [0.71] min. width
| NOTICE | ORDERING INFORMATION | |||
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18009, Rev H |






