
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 354000
RoHS/WEEE-Compliant
DIP-to-SOIC Adapter
FEATURES
- Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts.
GENERAL SPECIFICATIONS
- SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature
- PCB: 0.062 [1.58] thick FR-4 or IS410 per IPC4101A/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over Electroless Ni)
- MALE ADAPTOR PIN: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- MALE PIN PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 100μ [2.54μ] min. Ni per SAE-AMS-QQ-N-290
- FEMALE CONTACT PIN: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- FEMALE PIN PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 100μ [2.54μ] min. Ni per SAE-AMS-QQ-N-290
- 4-FINGER COLLET CONTACT: BeCu per UNS C17200 ASTM B194-01
- FEMALE CONTACT PLATING: 10μ [0.254μ] min. Au per MIL-G-45204 over 50μ [1.27μ] min. Ni per SAE-AMS-QQ-N-290
- CONTACT CURRENT RATING: 3 amps
- OPERATING TEMPERATURE: 221°F [105°C]
- INSERTION FORCE: 180g/pin; based on a 0.018 [0.46] dia. test lead
- WITHDRAWAL FORCE: 90g/pin; based on a 0.018 [0.46] dia. test lead
- NORMAL FORCE: 140g/pin; based on a 0.018 [0.46] dia. test lead
- SOCKET ACCEPTS: leads 0.015-0.025 [0.38-0.64] in dia., 0.0100-0.125 [2.54-3.18] long
MOUNTING CONSIDERATIONS
- SUGGESTED PCB SOLDER PAD SIZE: 0.028 [0.71] min. width
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Download Data
Sheet 18009RC, Rev AA |








