Series 354000 DIP-to-SOIC Adaptor, RoHS/WEEE-Compliant

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Convenient, cost-effective means of converting DIP-style packaging to SOIC PC board layouts.
GENERAL SPECIFICATIONS
- Socket Body black, UL 94 V-0 Glass-filled 4/6 Nylon 170°C Continuous Use Temperature
- PCB 0.062 thick FR406 or IS410 per IPC4101A/26 with 1-oz Copper traces, both sides finished with ENIG (Immersion Gold over electroless Nickel)
- Male Adaptor Pin Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
- Male Pin Plating 10µ min. Gold Per MIL-G-45204 over 100µ min. Nickel per SAE-AMS-QQ-N-290
- Female Contact Pin Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
- Female Pin Plating 10µ [0.254µ] min. Gold per MIL-G-45204 over 100µ [2.54µ] min. Nickel per SAE-AMS-QQ-N-290
- 4-fingered Collet Contact Beryllium-Copper alloy per UNS C17200 ASTM B194-01
- Female Contact Plating 10µ [0.254µ] min. Gold per MIL-G-45204 over 50µ [1.27µ] min. Nickel per SAE-AMS-QQ-N-290
- Contact Current Rating 3 amps
- Operating Temperature 221°F [105°C]
- Insertion Force 180g/pin; Withdrawal Force 90g/pin; Normal Force 140g/pin; based on 0.018 [0.46] dia. Test Lead
- Socket accepts Leads 0.015-0.025 [0.38-0.64] dia., 0.100-0.125 [2.54-3.18] long
MOUNTING CONSIDERATIONS
- Suggested PCB Solder Pad size 0.028 [0.71] min. width
| NOTICE | ORDERING INFORMATION | |||
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Download Data
Sheet 18009RC, Rev C |







