
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 350000
SOIC and SOJ-to-DIP Adapter
FEATURES
- A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout.
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16], or 0.600 [15.24] centers.
GENERAL SPECIFICATIONS
- BOARD MATERIAL: 0.062 [1.58] thick FR-4, UL94V-0, with 1-oz. Cu traces, both sides
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: 200µ [5.08µ] min. Sn per ASTM B 545 Type-1 or Sn/Pb 93/7 per ASTM B 545 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
- OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
| NOTICE | ORDERING INFORMATION | |||
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED “A” = NO. OF PINS PER ROW x 0.100 [2.54] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18010, Rev AC |






