Series 35000-11-RC High-Temperature SOIC DIP Adaptor

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adaptors on 0.400 [10.16] or 0.600 [15.24] centers.
GENERAL SPECIFICATIONS
- Board material 0.062 thick FR406 or IS410 PER IPC4101A/26 with 1-oz Copper traces, both sides
- Pads Finished with ENIG (Immersion Gold over electroless Nickel)
- Pins Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
- Pin Plating 10µ min. Gold per MIL-G-45204 over 100µ min. Nickel per SAE-AMS-QQ-N-290
- Operating Temperature 200°C maximum
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
| NOTICE | ORDERING INFORMATION | |
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Download Data
Sheet 18010RC, Rev D |





