
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 350000-11-RC
RoHS/WEEE-Compliant
SOIC-to-DIP Adapter
FEATURES
- A cost-effective means of upgrading to SOIC without changing your PCB layout
- Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers.
GENERAL SPECIFICATIONS
- BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides
- PADS: Finished with ENIG (Immersion Au over Electroless Ni)
- PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00
- PIN PLATING: 10µ [2.54µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
- OPERATING TEMPERATURE: 105°C max.
MOUNTING CONSIDERATIONS
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
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Download Data
Sheet 18010RC, Rev AB |






