
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 45000X-11-RC
and 65000X-11-RC
SOIC & SOJ-to-DIP Adapter RoHS/WEEE-Compliant
FEATURES
- Pb-Free RoHS/WEEE-compliant
- A cost-effective means of upgrading to SOJ or SOIC without changing your PCB layout.
- Available on 0.400 [10.16] and 0.600 [15.24] centers. Consult Data Sheet 18010 for Adapters on 0.300 [7.62] centers.
GENERAL SPECIFICATIONS
- BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides
- PADS: finished with ENIG (Immersion Au over Electroless Ni)
- PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-4524 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
- OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.002 [0.71 ±0.05] dia.
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Download Data
Sheet 18011RC, Rev AB |






