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SOIC-to-JEDEC TO Adaptor

SOIC-to-TO Adaptor

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.
  • Consult factory for mounting of consigned chips.
  • DIP-to-JEDEC TO Adaptor also vailable. Consult Data Sheet 18012.

GENERAL SPECIFICATIONS

  • Adapter board is FR-4, 0.062 [1.58] thick, with 1-oz Copper traces both sides
  • Male pin is Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
  • Male pin plating is 200µ [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 ASTM B 545 over 100µ [2.54µm] Nickel per SAE-AMS-QQ-N-290
  • Operating temperature=221°F [105°C]

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter

 

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

Reference-Only Drawing for SOIC-to-TO Adaptor
DIM. “C”
0.200 [5.08]
0.300 [7.62]
0.270 [6.85]

 

Download Data Sheet 18013, Rev F