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SOIC-to-TO Adaptor
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

SOIC-to-JEDEC TO Adapter

FEATURES

  • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.
  • Consult factory for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • ADAPTER BOARD: FR-4, 0.062 [1.58] thick, with 1-oz. Cu traces both sides
  • MALE PIN: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • MALE PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

DIP-to-TO ADAPTER ALSO AVAILABLE. ONSULT DATA SHEET 18012

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 
Reference-Only Drawing for SOIC-to-TO Adaptor
DIM. “C”
0.200 [5.08]
0.300 [7.62]
0.270 [6.85]

 

Download Data Sheet 18013, Rev AA