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SOIC-to-JEDEC TO RoHs-Compliant Adaptor

SOIC-to-TO Adaptor RoHs-Compliant

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Lead-Free RoHs/WEEE-Compliant
  • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.
  • Consult factory for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • Adaptor Board 0.062 thick FR406 or IS410 per IPC4101A/26 with 1-oz Copper traces, both sides
  • Male Pin Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
  • Male Pin Plating 10µ min. Gold per MIL-G-45204 over 100µ min. Nickel per SAE-AMS-QQ-N-290
  • Operating Temperature 221°F [105°C]

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

 

 

DIP-to-TO Adaptor also available. Consult Data Sheet 18012.

 

Reference-Only Drawing for SOIC-to-TO Adaptor RoHs-Compliant

 

Download Data Sheet 18013RC, Rev A