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SOIC-to-TO Adaptor RoHs-Compliant
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

RoHs/WEEE-Compliant
SOIC-to-JEDEC TO Adapter

FEATURES

  • Pb-Free RoHs/WEEE-compliant
  • 8-position SOIC footprint on the top and a circular, 8-pin JEDEC TO can male pin footprint on the bottom. ICs now available only in 8-position SOIC packages can be readily mounted on boards having JEDEC TO thru-hole footprints without having to redesign the board.
  • Consult factory for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • ADAPTER BOARD: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides
  • MALE PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • MALE PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

DIP-to-TO ADAPTER ALSO AVAILABLE. CONSULT DATA SHEET 18012

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

 

 
Reference-Only Drawing for SOIC-to-TO Adaptor RoHs-Compliant

 

Download Data Sheet 18013RC, Rev AA