Series 352000 and 353000 PLCC-to-DIP Adaptor

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Converts PLCC packaged ICs to DIP footprints.
- Ideal for prototyping and testing/evaluation.
- Available with PLCC sockets or PLCC pads on top side.
- Consult factory for Panelized Form or for mounting of consigned ICs.
GENERAL SPECIFICATIONS
- Adapter body is FR-4, 0.062 [1.58] thick, with 1-oz minimum Copper traces
- Pins are Brass Alloy 360 1/2-hard per UNS C36000 ASTMB16- 00
- Pin plating is 200µ [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100µ [2.54µm] Nickel per SAE-AMS-QQ-N-290
- Optional PLCC sockets are UL 94V-0 PPS
- Socket contacts are Phosphor Bronze
- Socket contact plating is 200µ min. Tin/Lead 93/7 per ASTM B 545 over 50µ min. Nickel per SAE-AMS-QQ-290
- Current rating = 1 Amp
- Operating temperature = 221°F [105°C]
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
- Will plug into Standard IC Socket
- See Table for Pad Layout when Mounting PLCC Socket
| NOTICE | ORDERING INFORMATION | |||
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18015, Rev C |




