
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.
Series 352000 and 353000 PLCC-to-DIP Adapter
FEATURES
- Converts PLCC packaged ICs-to-DIP footprints.
- Ideal for prototyping and testing/evaluation.
- Available with PLCC sockets or PLCC pads on top side.
- Consult factory for Panelized Form or for mounting of consigned ICs.
GENERAL SPECIFICATIONS
- ADAPTER BODY: 0.062 [1.58] thick, FR-4 with 1-oz. Cu traces
- PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
- PIN PLATING: Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
- OPTIONAL PLCC SOCKET: UL 94V-0 PPS
- SOCKET CONTACTS: Phosphor Bronze
- SOCKET CONTACT PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 50µ [1.27µ] Ni per SAE AMS-QQ-290
- CURRENT RATING: 1 amp
- OPERATING TEMPERATURE: 221°F [105°C]
MOUNTING CONSIDERATIONS
- SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
- Will plug into standard IC socket
- See Table for Pad Layout when mounting PLCC socket
| NOTICE | ORDERING INFORMATION | |||
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18015, Rev AA |





