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P/N 95-132I25 – QFP-to-PGA Adaptor for JEDEC 132-Position, 0.025 [0.64] Pitch
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

P/N 95-132I25 JEDEC 132-Position
QFP-to-PGA Adapter 0.025 [0.64] Pitch

FEATURES

  • Convert surface-mount QFP packages to a 13x13 PGA footprint.
  • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs.
  • Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
  • Consult factory for Panelized Form or for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • ADAPTER BODY: FR-4 with 1-oz. Cu traces
  • PADS: Bare Cu protected with Entek® by Enthone or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
  • Will plug into standard PGA socket
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08]

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 
Reference-Only Drawing for P/N 95-132I25 – QFP-to-PGA Adaptor for JEDEC 132-Position, 0.025 [0.64] Pitch

 

Download Data Sheet 18017, Rev AA