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P/N 96-160M65 QFP-to-PGA 160-Position, 0.0256 [0.65] Pitch Adaptor

P/N 96-160M65 - QFP-to-PGA Adapter for 160-Position, 0.0256 [0.65] Pitch

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Convert surface-mount QFP packages to a 15x15 PGA footprint.
  • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs.
  • Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact.
  • Consult factory for Panelized Form or for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • Adapter body is FR-4 with 1-oz minimum Copper traces
  • Pads are finished with ENIG (Immersion Gold over Electroless Nickel)
  • Pins are Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
  • Pin plating is 200µ" [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100µ" [2.54µm] Nickel per SAE-AMS-QQ-N-290
  • Operating temperature = 221°F [105°C]

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
  • Will plug into Standard PGA Socket

 

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

TOLERANCES
ROW-TO-ROW ±0.003 ±[0.08]
PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE
ALL OTHERS ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

Reference-Only Drawing for P/N 96-160M65 – QFP-to-PGA Adapter for 160-Position, 0.0256 [0.65] Pitch

 

Download Data Sheet 18020, Rev H