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P/N 97-AQ132D PQFP-to-PGA 132-Pin Amp Footprint Socket

P/N 97-AQ132D - 132-Pin PQFP-to-Amp Socket PGA Footprint

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint.
  • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs.
  • Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact.
  • Consult factory for Panelized Form or for mounting of consigned chips.

GENERAL SPECIFICATIONS

  • Body Material is FR-4, 0.062 [1.58] thick, with 1-oz minimum Copper traces
  • Pads are bare Copper protected with ENIG (Immersion Gold over Electroless Nickel) to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling
  • Pin is Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16- 00
  • Pin plating is 200µ" [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100µ" [2.54µm] Nickel per SAE-AMS-QQ-N-290
  • Operating temperature = 221°F [105°C]

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
  • Will plug into existing PGA footprint with matching Pad assignments

 

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCES [MILLIMETERS]

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

TOLERANCES:
ROW-TO-ROW: ±0.003 [0.08]
PIN-TO-PIN: ±0.003 [0.08] NON-CUMULATIVE
ALL OTHERS: ±0.005 [0.08] UNLESS OTHERWISE SPECIFIED

 

 

 

Reference-Only Drawing for P/N 97-AQ132D – 132-Pin PQFP-to-Amp Socket PGA Footprint
 Reference-Only Drawing of Panelized Form for P/N 97-AQ132D – 132-Pin PQFP-to-Amp Socket PGA Footprint

 

Download Data Sheet 18022, Rev E