P/N 97-68340 QFP-to-PGA Motorola 68340 144-Pin Adaptor

ARIES
SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS
SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN
BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Convert surface-mount QFP packages to a 15x15 PGA footprint.
- Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs.
- Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact.
- Consult factory for Panelized Form or for mounting of consigned chips.
GENERAL SPECIFICATIONS
- Adapter body is FR-4, 0.062 [1.58] thick, with 1-oz minimum Copper traces
- Pads are bare Copper protected with ENIG or immersion white tin to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling
- Pins are Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00
- Pin plating is 200µ" [5.08µm] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100µ" [2.54µm] Nickel per SAE-AMS-QQ-N-290
- Operating temperature = 221°F [105°C]
MOUNTING CONSIDERATIONS
- Suggested PCB Hole size 0.062 ±0.003 [1.58 ±0.08] diameter
- Will plug into Standard PGA Socket
| NOTICE | ORDERING INFORMATION | |||
ALL DIMENSIONS IN INCES [MILLIMETERS] TOLERANCES PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 18025, Rev K |




