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Series 351000 SSOP-to-DIP Adapter RoHS/WEEE-Compliant
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

Series 351000 SSOP-to-DIP RoHS/WEEE-Compliant Adapter

FEATURES

  • RoHS/WEEE-Compliant
  • Allows the use of 0.65mm pitch surface mount ICs in thru-hole designs.
  • Ideal for prototyping and testing/evaluating SSOP ICs.
  • Adapter can be cut to smaller sizes by end user.
  • Consult factory for Panelized Form or for mounting of consigned ICs.

GENERAL SPECIFICATIONS

  • ADAPTER BODY: 0.062 [1.58] thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides
  • PADS: finished with ENIG (Immersion Au over Electroless Ni)
  • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] min. Ni per SAE AMS-QQ-N-290B
  • CURRENT RATING: 1 amp
  • OPERATING TEMPERATURE: 221°F [105°C]

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia.
  • Will plug into standard IC socket
NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

“A” # OF PINS PER ROW x 0.100 [2.54]
“B” (# OF PINS PER ROW -1) x 0.100 [2.54]
“C” (# OF PADS PER ROW -1) x 0.0256 [0.65]

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 
Reference-Only Drawing for Series 351000 SSOP-to-DIP Adapter RoHS/WEEE-Compliant

 

Download Data Sheet 18036RC, Rev AA