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P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor

P/N 1110748 - Surface Mount-to-DIP Adaptor for SOT-25, SOT-23A-6

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards.
  • Solder masked top-side pads allow user to hand solder devices directly to topside of adaptor with fewer problems of solder bridging.
  • Longer male bottom Pins available at special request for easy use of probe clips.
  • Large topside pads allow for soldering test pins, jumpers, etc. to top of adaptor.

GENERAL SPECIFICATIONS

  • Board material is 0.062 [1.58] thick FR-4 manufactured to IPC- 600E, Class 2 standards, with 1-oz. Copper traces, both sides
  • Pads are HASL
  • Pins are Brass Alloy 360 1/2-hard per UNS C36000 ASTMB16- 00
  • Pin plating is 200µ" [5.08µm] min. Tin/Lead 93/7 ASTM B 545 over 100µ" [2.54µm] Nickel per SAE-AMS-QQ-N-290
  • Operating Temperature 221°F [105°C]
  • All CAC’s are manufactured and inspected using IPC -610B Class 2 Guidelines

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter

 

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

 

 

Consult factory for mounting of consigned chips.

 

Reference-Only Drawing for P/N 1110748 – Surface Mount-to-DIP Adaptor for SOT-25, SOT-23A-6

 

Download Data Sheet 18043, Rev C