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P/N 1110748 - Surface Mount-to-DIP Adaptor for SOT-25, SOT-23A-6
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.P/N 1110748 Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adapter

FEATURES

  • Allows for breadboarding or substitution of Microgate SOT-23A-6 and SOT-25 IC and transistor packages into 0.100 [2.54] pitch proto boards or PC boards.
  • Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging.
  • Longer male bottom Pins available at special request for easy use of probe clips.
  • Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.

GENERAL SPECIFICATIONS

  • Board Material: 0.062 [1.58] thick FR-4 manufactured to IPC- 600E, Class 2 standards, with 1-oz. Cu traces, both sides
  • Pads: HASL
  • Pins: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
  • Pin Plating: 200µ" [5.08µm] Sn/Pb 93/7 ASTM B579-73 over 100µ" [2.54µm] Ni per SAE-AMS-QQ-N-290
  • Operating Temperature: 221°F [105°C]
  • All CAC’s are manufactured and inspected using IPC -610B Class 2 Guidelines

MOUNTING CONSIDERATIONS

  • Suggested PCB Hole Size: 0.028 ±0.003 [0.71 ±0.08] dia.
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

 

 

 

Consult factory for mounting of consigned chips.
Reference-Only Drawing for P/N 1110748 – Surface Mount-to-DIP Adaptor for SOT-25, SOT-23A-6

 

Download Data Sheet 18043, Rev E