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BGA Switch-A-Pitch Adaptors
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

BGA Switch-A-Pitch Adapters

FEATURES

  • Reduce HDI construction by adapting smaller pitch devices to larger footprints
  • Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements)
  • Enable the use of standard line and trace spacing
  • Eliminate the need for laser-drilled micro vias motherboards

GENERAL SPECIFICATIONS

  • BOARD MATERIAL: 0.062 [1.58] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides
  • PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
  • SOLDER SPHERES: 63/37 Sn/Pb or Pb-free SAC 305
  • TRACE WIDTH/SPACE: 0.003 [0.0762]
  • OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB PAD SIZE: 0.022 [0.559] for 1.27mm pitch; 0.020 [0.51] for 1.00mm pitch
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

To obtain a quote for a specific adapter, please email a request to info@arieselec.com with the following information:

  • Your name, company name, and telephone number
  • A drawing or data sheet of the device to be placed on adapter
    (top image)
  • A drawing or data sheet of the target footprint for the adapter
    (bottom image)
  • A list of any other design parameters or restrictions that must be considered
  • The quantity of adapters to be quoted

Available in panelized form, adapter only, or as a turnkey solution with devices mounted. Consult factory.
BGA Switch-A-Pitch Adaptors

 

Download Data Sheet 18106, Rev AB