Aries Electronics - Your Best Source for Interconnection and Packaging Solutions
Fine Pitch Bump Adaptors

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

Fine Pitch Bump Adapters

FEATURES

  • Adapt to fine pitch footprints including TSSOPs and QFP's with pitches down to 0.4mm
  • Features raised connection pads up to 0.010 [0.25]
  • Available in tape and reel for high speed SMT assembly
  • Can be manufactured for RoHS compliance

GENERAL SPECIFICATIONS

  • BOARD MATERIAL: 0.032 [0.813] thick FR-4 or Rogers 370 HR, with 1/2-oz. Cu traces, both sides
  • PADS: finished with ENIG (Electroless Ni Immersion Au), NSMD
  • TRACE WIDTH/SPACE: 0.003 [0.076]
  • OPERATING TEMPERATURE: 221°F [105°C] FR-4, 266°F [130°C] Pb-free

MOUNTING CONSIDERATIONS

  • Solders to existing PCB footprints for QFP's, TSSOPs, and many other fine pitch devices down to 0.4mm
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

To obtain a quote for a specific adapter, please email a request to info@arieselec.com with the following information:

  • Your name, company name, and telephone number
  • A drawing or data sheet of the device to be placed on adapter
    (top image)
  • A drawing or data sheet of the target footprint for the adapter
    (bottom image)
  • A list of any other design parameters or restrictions that must be considered
  • The quantity of adapters to be quoted

Available in panelized form, adapter only, or as a turnkey solution with devices mounted. Consult factory.
Fine Pitch Bump Adaptors

 

Download Data Sheet 18107, Rev AB