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BGA Adaptor Socket

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

• System (adaptor and socket combination) converts any BGA device into a PGA on 1.27mm [0.050] or 1.50mm [0.059] pitch.
• Allows BGA device to be plugged into and removed from application motherboard.
• Socket accepts Aries’ BGA-to-PGA adaptor, Data Sheet 23007.

GENERAL SPECIFICATIONS

• Socket Body UL 94 V-0 FR406
• Pin Body Brass alloy 360 1/2-hard per UNS C36000 ASTM B16-00
• 3-fingered Collet Contact Berylliuim-Copper alloy per UNS C17200 ASTM B194-01 (thru-hole and standard surface-mount pin)
• Pin Body Plating is either 200µ [5.08µ] Tin per ASTM B545 Type 1 or 93/7 Tin/Lead per ASTM B545 or 10µ [0.25µ] Gold per MIL-G-45204 over 100µ [2.54µm] Nickel per SAE-AMS-QQ-N-290
• Contact Plating i30µ [0.76µ] Gold per MIL-G-45204 over 50µ [1.27µ] Nickel per SAE-AMS-QQ-N-290
• Contact Current Rating 3 amps
• Operating Temperature -67° to 221°F [-55° to 105°C] for Tin and -67° to 257°F [-55° to 125°C] for Gold
• Insertion Force 45g/pin; Withdrawal Force 22g/pin; Normal Force 31g/pin; based on 0.019 [0.48] dia. Test Lead

MOUNTING CONSIDERATIONS

• Suggested PCB Hole size 0.028 ±0.003 [0.71 ±0.08] diameter
• Suggested PCB Pad size 0.040 ±0.003 [1.02 ±0.08] diameter

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR PITCH-CONVERTING ADAPTOR & SOCKET REQUIREMENTS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

 

 

Download Data Sheet 23008, Rev D