CSP/Ballnest™ Hybrid Socket

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Any grid size available on 0.40mm pitch or larger
- Socket lid nests device into socket for a reliable connection
- Suitable for prototyping, test or burn-in of CSP, BGA, µBGA and LGA devices
- ZIF-style socket using Aries solderless, Gold-plated Pressure-mount Spring Probe
- Special lid designs and/or materials can be quoted
- Socket easily located, mounted and removed from PCB
- Signal path during test-only 0.077 [1.92]
- 4-point crown insures “scrub” on solder oxides. Consult Factory for other available Probe Styles
- Gold over Nickel-plated Compression Spring Probes leave small witness marks on the device’s solder balls.
GENERAL SPECIFICATIONS
- Body Material PEEK or Torlon®
- 1dB Bandwidth at 1GHz [0.80] Pitch) (large probe)
- Estimated Contact Life 500,000 Cycles
- Compression Spring Probes Heat-treated Beryllium-Copper alloy with 30µ min [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
- Contact Force 16/Contact on 0.40mm Pitch 25g/Contact on 0.50-0.75mm and 0.80mm Pitch or Larger
- Screws and Alignment Pins Stainless Steel
- Inserts Brass alloy per QQ-B-626, Tin-plated
- Operating Temperature Range -55ºC to 150ºC [-67ºF to 302ºF]
MOUNTING CONSIDERATIONS
- Sockets must be handled with care when mounting or removing to/from PCB
- Test Board PCB diameter 0.025 [0.635] (Large Probe 0.80mm Pitch and Larger) 0.015 [0.381] (Small Probe 0.50-0.75mm Pitch) 0.012 [0.300] (Small Probe 0.40mm Pitch)
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
Detailed device drawing must be sent to Aries quotation and socket design. Use Aries’ BGA Order Sheet, Data Sheet 23000 for prompt quotations. |
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Download Data
Sheet 23016, Rev D |






