CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM, and Flash Devices. Consult factory for QFP applications.
- For any pitch device on 0.40mm or higher
- Socket is easily mounted and removed to and from the Burn-in Board (BIB) with Solderless Pressure-mount Compression Spring Probes, accurately located with two molded plastic Alignment Pins and mounted with four Stainless Steel screws.
- Gold over Nickel-plated Compression Spring Probes leave small witness marks on the device’s solder balls.
- Small overall socket size/profile allows maximum number of sockets per BIB, while being operator-friendly.
- Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom-molded (for large quantities) Pressure Pads and Interposers.
- Pressure Pad Compression Spring provides proper force against device and allows for height variations in device thickness.
- 4-point crown insures “scrub” on solder oxides
- Signal path during test-only 0.077 [1.92]
GENERAL SPECIFICATIONS
- Molded Socket Components UL 94 V-0 Ultem
- Machined Socket Components UL 94 V-0 PEEK or Torlon®
- All Hardware Stainless Steel
- Compression Spring Probes are heat-treated Beryllium-Copper alloy
- Compression Spring Probe Plating 30µ min. [0.75µ] Gold per Mil-G- 45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
- Durability 500,000 cycles minimum
- Contact Force 16g/contact on 0.40mm pitch; 25g/contact on 0.50-0.75mm pitch; 25g/contact on 0.80mm pitch or larger
- Operating Temperature -55°C to 150°C [-67°F to 302°F]
- Typical Average Burn-In Temperature 150°C maximum
MOUNTING CONSIDERATIONS
- See “FOOTPRINT TOP VIEW” for requirements.
- Requires four #2-56 screws and PEM nuts for mounting – not supplied (mounting holes size shown may differ depending on PEM nut selected)
- Sockets must be handled with care when mounting or removing to/from BIB to avoid damaging sensitive Spring Contacts.
- Test Board PCB diameter 0.025 [0.635] (Large Probe 0.80mm Pitch and Larger) 0.015 [0.381] (Small Probe 0.50-0.75mm Pitch) 0.012 [0.300] (Small Probe 0.40mm Pitch)
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
Factory will supply socket drawing with “AH” dimensions. Legible dimensioned Device Drawing required at quote request and time of order. |
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Download Data
Sheet 23017, Rev G |






