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CSP/MICRO BGA Test & Burn-in Socket for Devices from 14-27mm Square
CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.
CSP/µBGA Test & Burn-in Socket for Devices from 14-27mm Square

FEATURES

  • For Test & Burn-In of CSP, μBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
  • Any pitch device on 0.30mm or larger
  • Pressure mounting, no soldering required
  • 4 Point crown insures scrub on solder oxides
  • Signal path during test only 0.077 [1.96]
  • Accommodates any package up to 27mm square
  • Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly

SPECIFICATIONS

  • Molded Socket Components: UL94V-0 PEEK and/or Ultem
  • 1dB Bandwidth: 1GHz (0.80mm pitch) (large probe)
  • Estimated Contact Life: 500,000 cycles
  • Compression Spring Probes: heat-treated Be-Cu with 30μ minimum [0.75μ] Au per Mil-G-45204 over 30μ min. [0.75μ] Ni per SAE-AMS QQ-N-290
  • Contact Force :
    15g per contact on 0.30-0.35mm pitch
    16g per contact on 0.40-0.45mm pitch
    25g per contact on 0.50-0.75mm pitch
    25g per contact on 0.80mm pitch or larger
  • Operating Temperature: -55°C (min.) to 150°C [-67°F to 302°F] max.
  • All Hardware: Stainless Steel
  • Typical Burn-in Temperature: 150°C [302°F] maximum

MOUNTING CONSIDERATIONS

  • Socket: mounted with four #4-40 screws to either a plastic shipping plate (to be removed at time of socket mounting or PCB) or a tapped insulated backing plate to be used on underside of PCB for high pin count applications
  • Sockets must be handled with care when mounting or removing sockets to/from PCB
  • Test PCB Diameter “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger)
    : 0.015 [0.38] (small probe 0.50-0.75mm pitch)
    : 0.012 [0.31] (small probe 0.40-0.45mm pitch)
    : 0.009 [0.23] (small probe 0.30-0.35mm pitch)
  • Test PCB Diameter Spring Probe Pad Plating Spec: 30µ" min. [0.75µ] Au per MIL-G-45204 over 30µ" min. Ni per SEA-AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.
  • Some applications may require a Backup Plate. See drawing for more information.

TEST REPORTS

 

NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

Consult Factory or...

GET AN “INSTA-QUOTE”

 

See Also Data Sheet...
  23021 µBGA up to 6.5mm
  23017 µBGA up to 13mm
  23018 µBGA up to 27mm
  23018-APP w/Adj Pressure Pad
  23019 µBGA up to 40mm
  23020 µBGA up to 55mm
  24013 RF up to 6.5mm
  24008 RF up to 13mm
  24009 RF up to 27mm
  24011 RF up to 40mm
  24012 RF up to 55mm
  23016 CSP/BallNest Hybrid
  24010 RF Machined Socket
  23022 Kelvin Test Socket
Reference-Only Drawings for CSP/MICRO BGA Test & Burn-in Socket for Devices from 14-27mm Square
23018 Spring Probes

 

Download Data Sheet 23018, Rev I