
CUSTOMIZATION: In addition to the standard products shown on this page, Aries
specializes in custom design and production. Special materials, platings, sizes,
and configurations can be furnished, depending on quantity. NOTE: Aries reserves
the right to change product specifications without notice.CSP/µBGA
Test & Burn-in Socket for Devices from 14-27mm Square
FEATURES
- For Test & Burn-In of CSP, μBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
- Any pitch device on 0.30mm or larger
- Pressure mounting, no soldering required
- 4 Point crown insures scrub on solder oxides
- Signal path during test only 0.077 [1.96]
- Accommodates any package up to 27mm square
- Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly
SPECIFICATIONS
- Molded Socket Components: UL94V-0 PEEK and/or Ultem
- 1dB Bandwidth: 1GHz (0.80mm pitch) (large probe)
- Estimated Contact Life: 500,000 cycles
- Compression Spring Probes: heat-treated Be-Cu with 30μ minimum [0.75μ] Au per Mil-G-45204 over 30μ min. [0.75μ] Ni per SAE-AMS QQ-N-290
- Contact Force :
15g per contact on 0.30-0.35mm pitch
16g per contact on 0.40-0.45mm pitch
25g per contact on 0.50-0.75mm pitch
25g per contact on 0.80mm pitch or larger - Operating Temperature: -55°C (min.) to 150°C [-67°F to 302°F] max.
- All Hardware: Stainless Steel
- Typical Burn-in Temperature: 150°C [302°F] maximum
MOUNTING CONSIDERATIONS
- Socket: mounted with four #4-40 screws to either a plastic shipping plate (to be removed at time of socket mounting or PCB) or a tapped insulated backing plate to be used on underside of PCB for high pin count applications
- Sockets must be handled with care when mounting or removing sockets to/from PCB
- Test PCB Diameter “G” : 0.025 [0.64] (large probe 0.80mm pitch
and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch) - Test PCB Diameter Spring Probe Pad Plating Spec: 30µ" min. [0.75µ] Au per MIL-G-45204 over 30µ" min. Ni per SEA-AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.
- Some applications may require a Backup Plate. See drawing for more information.
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |||||||||||||||||||||||||||||||
CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
Consult Factory or...
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Download Data
Sheet 23018, Rev I |






