CSP/µBGA Test & Burn-in Socket for Devices from 14-27mm Square

For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM, and Flash Devices. Consult Factory for QFP applications.
Any pitch device on 0.40mm or larger.
Pressure-mounting, no soldering required.
4-point Crown insures “scrub” on solder oxides.
Signal path during test-only 0.077 [1.92mm]
Accommodates any package up to 27mm square
Small overall socket size/profile allows maximum number of sockets per Burn-in Board and BIB’s per oven, while being operator-friendly.

Molded Socket Components UL 94 V-0 PEEK and/or Ultem.
1dB Bandwidth at 1GHz (0.80mm pitch) (large probe).
Estimated Contact Life 500,000 Cycles
Compression Spring Probes are heat-treated Beryllium-Copper alloy with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min.[0.75µ] Nickel per SAE-AMS-QQ-N-290
Contact Force 16g/contact on 0.40mm pitch; 25g/contact on 0.50-0.75mm pitch; 25g/contact on 0.80mm pitch or larger
Operating Temperature -55°C to 150°C [-67°F to 302°F]
All Hardware is Stainless Steel
Typical Burn-In Temperature 150°C maximum

Socket is mounted with four #4-40 screws to either a plastic shipping plate (to be removed at time of socket mounting or PCB) or a tapped insulated backing plate to be used on underside of PCB for high pin count applications.
Sockets must be handled with care when mounting or removing to/from BIB to avoid damaging sensitive Spring Contacts.
Test Board PCB dia. 0.025 [0.635] (Large Probe 0.80mm Pitch and Larger) 0.015 [0.381] (Small Probe 0.50-0.75mm Pitch) 0.012 [0.300] (Small Probe 0.40mm Pitch)

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED	Consult Factory or... GET AN “INSTA-QUOTE”