CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.CSP/µBGA Test & Burn-in Socket for Devices up to 40mm Square

For Test & Burn-In of CSP, μBGA, DSP, LGA, SRAM, DRAM and Flash Devices
Any pitch device on 0.30mm or larger
4-point crown insures “scrub” on solder oxides
Single Point Probes available for small land area contact pads
Signal path during test only 0.077 [1.96]
Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which are accurately located by 2 molded plastic alignment pins and mounted with 4 stainless steel screws
The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
Standard molded socket format can accommodate any device package of 40mm or smaller
Pressure pad compression spring provides proper force against device and allows for height variations in device thickness

Molded Socket Components: UL94V-0 PEEK and/or Ultem
1dB Bandwidth: 1GHz (0.80mm pitch) (large probe)
Estimated Contact Life: 500,000 cycles
Compression Spring Probes: heat-treated Be-Cu with 30μ min. [0.75μ] Au per Mil-G-45204 over 30μ min. [0.75μ] Ni per SAE-AMS-QQ-N-290
Contact Force :
15g per contact on 0.30-0.35mm pitch
16g per contact on 0.40-0.45mm pitch
25g per contact on 0.50-0.75mm pitch
25g per contact on 0.80mm pitch or larger
Operating Temperature: -55°C (min.) to 150°C (max.) [-67°F to 302°F]
All Hardware: Stainless Steel
Typical Burn-in Temperature: 150°C maximum

See “PCB FOOTPRINT TOP VIEW” for requirements
Sockets must be handled with care when mounting or removing sockets to/from PCB
Test PCB Diameter “G” : 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
Test PCB Diameter Spring Probe Pad Plating Spec: 30µ" min. [0.75µ] Au per MIL-G-45204 over 30µ" min. Ni per SEA-AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.
Some applications may require a Backup Plate. See drawing for more information.

NOTICE

ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED