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CSP/µBGA Test & Burn-In Socket for Devices up to 55mm Square

Chinese

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.FEATURES

• For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
• Any device on 0.30mm pitch or larger
• 4-point crown insures “scrub” on solder oxides
• Single-point Probes available for small land area contact pads
• Signal path during test only 0.077 [1.96]
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
• The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
• Standard molded socket format can accommodate any device package of 55mm square or smaller
• The spring-loaded, cam-actuated Pressure Pad applies proper force against the device after the lid is closed, latched and the cam is rotated to it’s detected location. Reversing the cam removes the force applied to the device prior to unlatching the spring loaded lid to it’s upright position

GENERAL SPECIFICATIONS

• MOLDED SOCKET COMPONENTS: UL 94V-0 PEEK and/or Ultem
• 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
• ESTIMATED CONTACT LIFE: 500,000 cycles
• COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min. [0.75µ] Ni per SAE AMS-QQ-N-290B
• CONTACT FORCE:
  : 15g per contact on 0.30-0.35mm pitch
  : 16g per contact on 0.40-0.45mm pitch
  : 25g per contact on 0.50-0.75mm pitch
  : 25g per contact on 0.80mm pitch or larger
• OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°F] max.
• ALL HARDWARE: Stainless Steel
• TYPICAL BURN-IN TEMPERATURE: 150°C max.

MOUNTING CONSIDERATIONS

• See “PCB FOOTPRINT TOP VIEW” for requirements.
• NOTE: Sockets must be handled with care when mounting or removing sockets to/from PCB
• TEST PCB DIA. "G": 0.025 [0.64] (large probe 0.80mm pitch and larger)
  : 0.015 [0.38] (small probe 0.50-0.75mm pitch)
  : 0.012 [0.31] (small probe 0.40-0.45mm pitch)
  : 0.009 [0.23] (small probe 0.30-0.35mm pitch)
• TEST PCB DIA. SPRING PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.

TEST REPORTS

Select Test Report... 0.50mm Center Probe™ Test Contact 0.50mm Center Probe™ Test Contact Return Loss Graph 0.80mm Center Probe™ Test Contact 0.80mm Center Probe™ Test Contact Return Loss Graph Center Probe™ CSP DC Measurements w/Cycling Center Probe™ CSP RF Measurements w/Cycling Center Probe™ CSP DC Measurements w/o Cycling Center Probe™ CSP RF Measurements w/o Cycling

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET AN “INSTA-QUOTE”   See Also Data Sheet...   23021 µBGA up to 6.5mm   23017 µBGA up to 13mm   23018 µBGA up to 27mm   23018-APP w/Adj Pressure Pad   23019 µBGA up to 40mm   23020 µBGA up to 55mm   24013 RF up to 6.5mm   24008 RF up to 13mm   24009 RF up to 27mm   24011 RF up to 40mm   24012 RF up to 55mm   23016 CSP/BallNest™ Hybrid   24010 RF Machined Socket   23022 Kelvin Test Socket

 

Download Data Sheet 23020, Rev AA