CSP/µBGA Test & Burn-In Socket for Devices up to 55mm Square

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM, and Flash Devices. Consult Factory for QFP applications.
- Any device on 0.40mm pitch or larger.
- 4-point Crown insures “scrub” on solder oxides.
- Single-point Probes available for small land area contact pads.
- Signal path during test only 0.077 [1.92]
- Socket is easily mounted and removed to and from the Burn-in Board (BIB) with Solderless Pressure-mount Compression Spring Probes, accurately located with two molded plastic Alignment Pins and mounted with four Stainless Steel screws.
- Gold over Nickel-plated Compression Spring Probes leave small witness marks on the device’s solder balls.
- Standard molded socket format can accommodate any device package of 55mm square or smaller.
- Spring-loaded, cam-actuated Pressure Pad applies proper force against the device after the lid is closed, latched and the cam is rotated to it’s detented location. Reversing the cam removes the force applied to the device prior to unlatching the spring-loaded lid to it’s upright position.
GENERAL SPECIFICATIONS
- Molded Socket Components UL 94 V-0 PEEK and/or Ultem
- 1dB Bandwidth at 1GHz (0.80mm pitch) (large probe)
- Estimated Contact Life 500,000 Cycles
- Compression Spring Probes Heat-treated Beryllium-Copper alloy with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
- Contact Force 16g/contact on 0.40mm pitch; 25g/contact on 0.50mm - 0.75mm & 0.80mm pitch or larger
- Operating Temperature -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.)
- All Hardware is Stainless Steel
- Typical Burn-in Temperature 150°C maximum
MOUNTING CONSIDERATIONS
- See “PCB FOOTPRINT TOP VIEW” for requirements.
- Sockets must be handled with care when mounting or removing sockets to/from PCB.
- Test Board PCB diameter 0.025 [0.635] (Large Probe 0.80mm Pitch and Larger) 0.015 [0.381] (Small Probe 0.50-0.75mm Pitch) 0.012 [0.300] (Small Probe 0.40mm Pitch)
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
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Download Data
Sheet 23020, Rev G |






