CSP/µBGA Test & Burn-In Socket for Devices Up to 6.5mm Square

For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
Any pitch device on 0.30mm pitch or higher
Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws
The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
Small overall socket size/profile allows max. number of sockets per BIB and BIB’s per oven, while being operator friendly
Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers
Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
4-point crown insures “scrub” on solder oxides
Signal path during test only 0.077 [1.96]

MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
MACHINED SOCKET COMPONENTS: UL 94V-0 PEEK or Torlon
HARDWARE: Stainless Steel
COMPRESSION SPRING PROBES: heat-treated BeCu
COMPRESSION PIN PROBE PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min. [0.75µ] Ni per SAE AMS-QQ-N-290B
DURABILITY: 500,000 cycles min.
CONTACT FORCE:
: 15g per contact on 0.30-0.35mm pitch
: 16g per contact on 0.40-0.45mm pitch
: 25g per contact on 0.50-0.75mm pitch
: 25g per contact on 0.80mm pitch or larger
OPERATING TEMPERATURE: -55°C [-67°F ] min. to 150°C [302°F] max.
TYPICAL AVERAGE BURN-IN TEMPERATURE: 150°C max.

See “PCB FOOTPRINT TOP VIEW” for requirements.
REQUIRES: two #0-80 screws (supplied) and PEM nuts for mounting (not supplied). Mounting holes size shown may differ depending on PEM nut selected
NOTE: Sockets must be handled with care when mounting or removing sockets to/from BIB to avoid damaging sensitive spring contacts.
TEST PCB DIA. "G": 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
TEST PCB DIA. SPRING PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.

NOTICE

ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

FACTORY WILL SUPPLY SOCKET DRAWING WITH “A-H” DIMENSIONS. LEGIBLE DIMENSIONED DEVICE DRAWING REQUIRED AT QUOTE REQUEST AND TIME OF ORDER.

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

Download Data Sheet 23021, Rev AA