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CSP/MicroBGA Test & Burn-In Socket for Devices Up to 6.5mm Square

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

• For Test & Burn-In of CSP, μBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult factory for QFP applications
• Any pitch device on 0.30mm pitch or higher
• Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws
• The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
• Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly
• Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
• 4-point crown insures “scrub” on solder oxides
• Signal path during test only 0.077 [1.96]

SPECIFICATIONS

• Molded Socket Components: UL94V-0 Ultem
• Machined Socket Components: UL94V-0 PEEK or Torlon
• All hardware: Stainless Steel
• Compression Spring Probes: heat-treated Beryllium Copper
• Compression spring probe plating is 30μ min. [0.75μ] Gold per Mil-G-45204 over 30μ min. [0.75μ] Nickel per SAE-AMS-QQ-N-290
• Durability: 500,000 cycles minimum
• Contact Force :
  15g per contact on 0.30-0.35mm pitch
  16g per contact on 0.40-0.45mm pitch
  25g per contact on 0.50-0.75mm pitch
  25g per contact on 0.80mm pitch or larger
• Operating Temperature: -55°C (min.) to 150°C (max.) [-67°F to 302°F]
• Typical Average Burn-In Temperature: 150°C maximum

MOUNTING CONSIDERATIONS

• See “PCB FOOTPRINT TOP VIEW” for requirements.
• Requires two #0-80 screws (supplied) and PEM nuts for mounting (not supplied). Mounting holes size shown may differ depending on PEM nut selected
• Sockets must be handled with care when mounting or removing sockets to/from BIB to avoid damaging sensitive spring contacts.
• Test PCB Diameter “P” :
  0.025 [0.64] (large probe 0.80mm pitch and larger)
  0.015 [0.38] (small probe 0.50-0.75mm pitch)
  0.012 [0.31] (small probe 0.40-0.45mm pitch)
  0.009 [0.23] (small probe 0.30-0.35mm pitch)

TEST REPORTS

Select Test Report... 0.50mm Center Probe™ Test Contact 0.50mm Center Probe™ Test Contact Return Loss Graph 0.80mm Center Probe™ Test Contact 0.80mm Center Probe™ Test Contact Return Loss Graph Center Probe™ CSP DC Measurements w/Cycling Center Probe™ CSP RF Measurements w/Cycling Center Probe™ CSP DC Measurements w/o Cycling Center Probe™ CSP RF Measurements w/o Cycling window:New">Kapton QFP RF Measurements w/o Cycling

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET AN “INSTA-QUOTE”   See Also Data Sheet...   23000  BGA Order Data Sheet   23017  µBGA up to 13mm   23018  µBGA up to 27mm   23019  µBGA up to 40mm   23020  µBGA up to 55mm   24013  RF up to 6.5mm   24008  RF up to 13mm   24009  RF up to 27mm   24011  RF up to 40mm   24012  RF up to 55mm   23016  CSP/BallNest Hybrid   23022  Kelvin Test Socket   24010  RF Machined Socket

 

 

Download Data Sheet 23021, Rev B