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Kelvin Test Socket

Chinese

CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.FEATURES

• Low resistance testing using dual independent Aries Kelvin spring probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices.
• Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws
• The Au over Ni plated compression spring probes leave very small witness marks on the bottom surface of the device pads
• Small overall socket size/profile allows max. number of sockets per test board, while being operator friendly
• Kelvin Test Socket Contact System is available for any Aries CSP and Center Probe Test Sockets
• Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
• Probe blade edge tip for cutting through solder oxide layers
• Signal path during test only 0.082 [2.08]

GENERAL SPECIFICATIONS

• MOLDED SOCKET COMPONENTS: UL 94V-0 Ultem
• MACHINED SOCKET COMPONENTS: UL 94V-0 PEEK or Torlon
• ALL HARDWARE: Stainless Steel
• COMPRESSION SPRING PROBE: heat-treated BeCu
• COMPRESSION SPRING PROBE PLATING: 50µ min. [1.27µ] Au per MIL-G-45204 over 50µ min. [1.27µ] Ni per SAE AMS-QQ-N-290B
• DURABILITY: 500,000 cycles min.
• CONTACT FORCE: 16g/contact on 0.40-0.45mm pitch
• OPERATING TEMPERATURE:-55°C [-67°F] min. to 150°C [302°F] max.

MOUNTING CONSIDERATIONS

• See “PCB FOOTPRINT TOP VIEW” for requirements
• REQUIRES: four #2-56 screws and PEM nuts for mounting (not supplied – mounting holes size shown may differ depending on PEM nut selected)
• NOTE: Sockets must be handled with care when mounting or removing to/from test board to avoid damaging sensitive spring contacts
• TEST PCB DIA. "G": 0.012 [0.31] (small probe 0.40-0.45mm pitch)
• TEST PCB DIA. SPRING PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.

TEST REPORTS

Select Test Report... 0.50mm Center Probe™ Test Contact 0.50mm Center Probe™ Test Contact Return Loss Graph 0.80mm Center Probe™ Test Contact 0.80mm Center Probe™ Test Contact Return Loss Graph Center Probe™ CSP DC Measurements w/Cycling Center Probe™ CSP RF Measurements w/Cycling Center Probe™ CSP DC Measurements w/o Cycling Center Probe™ CSP RF Measurements w/o Cycling

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... For Quotation, Consult Factory with Details of Your Application and... GET AN “INSTA-QUOTE”   Also See Data Sheets...   23021 µBGA up to 6.5mm   23017 µBGA up to 13mm   23018 µBGA up to 27mm   23018-APP w/Adj Pressure Pad   23019 µBGA up to 40mm   23020 µBGA up to 55mm   24013 RF up to 6.5mm   24008 RF up to 13mm   24009 RF up to 27mm   24011 RF up to 40mm   24012 RF up to 55mm   23016 CSP/BallNest™ Hybrid   24010 RF Machined Socket   23022 Kelvin Test Socket

 

Download Data Sheet 23022, Rev AD