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Thermoelectric-cooled RF Test Socket

Thermoelectric-cooled RF Test Socket

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • Peltier Technology incorporated into test socket lid assembly.
  • Thermoelectric Cooler (TEC) provides fast and accurate temp control.
  • Built-in epoxy-encapsulated thermistor with Teflon sheathing for highly accurate temperature sensing of ±0.02°C.
  • Customized spring-loaded Copper pressue pad provides constant normal force on device under test.
  • Brushless DC fan is used to draw maximum heat away from finned heatsink.
  • Available for all Aries High-Frequency Test Sockets.

GENERAL SPECIFICATIONS

  • Socket Body Material Torlon® PAI
  • Hardware Stainless Steel
  • Maximum Package size 27mm x 27mm
  • TEC Temperature Differential 65°C
  • Maximum Current Input 8.5 amps
  • Maximum Voltage 8.5 volts
  • Qmax 38.50 watts
NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

 

Reference-Only Drawing for Thermoelectric-cooled RF Test Socket

 

Download Data Sheet 24002, Rev C