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Thermoelectric-cooled RF Test Socket

Thermoelectric-cooled RF Test Socket
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.FEATURES

  • Peltier Technology incorporated into test socket lid assembly.
  • Thermoelectric Cooler (TEC) provides fast and accurate temp control.
  • Built-in epoxy-encapsulated thermistor with Teflon sheathing for highly accurate temperature sensing of ±0.02°C.
  • Customized spring-loaded Cu pressue pad provides constant normal force on device under test.
  • Brushless DC fan is used to draw max. heat away from finned heatsink.
  • Available for all Aries High-Frequency Test Sockets.

GENERAL SPECIFICATIONS

  • SOCKET BODY MATERIAL: Torlon® PAI
  • HARDWARE: Stainless Steel
  • MAXIMUM PACKAGE SIZE: 27mm x 27mm
  • TEC TEMPERATURE DIFFERENTIAL: 65°C
  • MAXIMUM CURRENT INPUT: 8.5 amps
  • MAXIMUM VOLTAGE: 8.5 volts
  • QMAX: 38.50 watts
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  
Reference-Only Drawing for Thermoelectric-cooled RF Test Socket

 

Download Data Sheet 24002, Rev AA