High-Frequency Interposer Socket

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- Pressure-mount plunge to board interposer.
- Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more.
- Very low inductance per contact site.
- High cycle life with easy maintenance.
- Manual or Automated Handler applications.
- High-Frequency Appication: -1.0dB to 40GHz (0.5mm pitch)
GENERAL SPECIFICATIONS
- Socket Body Material specified at time of quotation
- Interposer etched Kapton with Gold-plated Pads and Compliant Pads on bottom side
- Available Pitches down to 0.32mm
- Contact Self-inductance 0.11nH (0.50mm pitch CSP).
- VSWR <2:1 to 40GHz
- Contact Resistance <20 millohms
- Contact Force 15-25 grams
- Current Capacity 5 amps
- Contact Life 50,000-100,000
- Signal Path Length 0.011 (with compliant pads)
- Mutual Capacitance 0.015pF
MOUNTING CONSIDERATIONS
- Suggestd PCB Pads Gold-plated
- Mounting Force 5-oz inches [0.035Nm]
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
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Download Data Sheet 24007,
Rev J |





