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High-Frequency Interposer Socket

High-Frequency Interposer Socket

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE.
FEATURES

  • Pressure-mount plunge to board interposer.
  • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more.
  • Very low inductance per contact site.
  • High cycle life with easy maintenance.
  • Manual or Automated Handler applications.
  • High-Frequency Appication: -1.0dB to 40GHz (0.5mm pitch)

GENERAL SPECIFICATIONS

  • Socket Body Material specified at time of quotation
  • Interposer etched Kapton with Gold-plated Pads and Compliant Pads on bottom side
  • Available Pitches down to 0.32mm
  • Contact Self-inductance 0.11nH (0.50mm pitch CSP).
  • VSWR <2:1 to 40GHz
  • Contact Resistance <20 millohms
  • Contact Force 15-25 grams
  • Current Capacity 5 amps
  • Contact Life 50,000-100,000
  • Signal Path Length 0.011 (with compliant pads)
  • Mutual Capacitance 0.015pF

MOUNTING CONSIDERATIONS

  • Suggestd PCB Pads Gold-plated
  • Mounting Force 5-oz inches [0.035Nm]

TEST REPORTS

 

NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

 

 

Reference-Only Drawing for High-Frequency Interposer Socket

 

Download Data Sheet 24007, Rev J