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High-Frequency Interposer Socket

High-Frequency Interposer Socket
CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.FEATURES

  • Pressure-mount plunge to board interposer.
  • Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more.
  • Very low inductance per contact site.
  • High cycle life with easy maintenance.
  • Manual or Automated Handler applications.

GENERAL SPECIFICATIONS

  • INSERTION LOSS: less than -1dB to 40GHz
  • SOCKET BODY MATERIAL: specified at time of quotation
  • INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side
  • AVAILABLE PITCHES: down to 0.32mm
  • CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP).
  • VSWR <2:1 to 40GHz
  • CONTACT RESISTANCE: <20 mΩ
  • CONTACT FORCE: 15-25 grams
  • CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak)
  • CONTACT LIFE: 50,000-100,000
  • SIGNAL PATH LENGTH: 0.011 (with compliant pads)
  • MUTUAL CAPACITANCE: 0.015pF

MOUNTING CONSIDERATIONS

  • SUGGESTED PCB PADS: Au-plated
  • MOUNTING FORCE: 5-oz inches [0.035Nm]

TEST REPORTS

 

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  
Reference-Only Drawing for High-Frequency Interposer Socket

 

Download Data Sheet 24007, Rev AC