High-Frequency Interposer Socket |

CUSTOMIZATION: In addition to the standard products shown on this page, Aries
specializes in custom design and production. Special materials, platings, sizes,
and configurations can be furnished, depending on quantity. NOTE: Aries reserves
the right to change product specifications without notice.FEATURES
- Pressure-mount plunge to board interposer.
- Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more.
- Very low inductance per contact site.
- High cycle life with easy maintenance.
- Manual or Automated Handler applications.
- High-Frequency Application: -1.0dB to 40GHz (0.5mm pitch)
GENERAL SPECIFICATIONS
- SOCKET BODY MATERIAL: specified at time of quotation
- INTERPOSER: etched Kapton with Au-plated Pads and Compliant Pads on bottom side
- AVAILABLE PITCHES: down to 0.32mm
- CONTACT SELF-INDUCTANCE: 0.11nH (0.50mm pitch CSP).
- VSWR <2:1 to 40GHz
- CONTACT RESISTANCE: <20 mΩ
- CONTACT FORCE: 15-25 grams
- CURRENT CAPACITY: 2 amps (continuous) 4 amps (peak)
- CONTACT LIFE: 50,000-100,000
- SIGNAL PATH LENGTH: 0.011 (with compliant pads)
- MUTUAL CAPACITANCE: 0.015pF
MOUNTING CONSIDERATIONS
- SUGGESTED PCB PADS: Au-plated
- MOUNTING FORCE: 5-oz inches [0.035Nm]
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
ALL DIMENSIONS IN INCHES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED |
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Download Data
Sheet 24007, Rev AA |




