High-Frequency Center Probe™ Test Socket for Devices up to 13mm Square

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD
PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION
CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT
SPECIFICATION WITHOUT NOTICE. FEATURES
- For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices.
- Any pitch device on 0.40mm pitch or higher.
- Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four Stainless Steel screws.
- The Gold over Nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls.
- Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
- Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
- 4 Point crown insures “scrub” on solder balls, and raised tip probe provides “scrub” on pads.
- Signal path during test only 0.077" (1.95mm)
GENERAL SPECIFICATIONS
- 1dB bandwith at 18.5GHz, <3dB to 39.7GHz (0.50mm pitch)
- Pin Inductance 0.59nH (at 0.50mm pitch)
- Mutual Capacitance 0.12pF
- VSWR <2:1 to 38GHz
- Contact Resistance <40 mOhms
- Compression Spring Probes heat-treated Beryllium-Copper alloy
- Compression Spring Probe Plating 30µ min. [0.75µ] Gold per Mil- G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
- Estimated Contact Life 500,000 cycles minimum
- Contact Force 16g/contact on 0.40mm pitch; 25g/contact on 0.50mm-0.75mm; 25g/contact on 0.80mm or larger
- Operating Temperature -55°C (min.) to 150°C (max.); -67°F (min.) to 302°C (max.)
- Molded Socket Components UL 94 V-0 Ultem
MOUNTING CONSIDERATIONS
- See “PCB FOOTPRINT TOP VIEW” for requirements.
- Requires four #2-56 screws and PEM nuts for mounting – Not supplied (mounting holes size shown may differ depending on PEM nut selected).
- Sockets must be handled with care when mounting or removing sockets to/from PCB to avoid damaging spring contacts.
- Test board PCB diameter 0.025” [0.635] (large probe 0.80mm pitch or larger); 0.015 [0.381] (small probe 0.50mm-0.75mm pitch); 0.012 [0.300] (small probe 0.40mm pitch
TEST REPORTS
| NOTICE | ORDERING INFORMATION | |
Consult Factory or...
Factory will supply Socket Drawing with “AH” dimensions. Legible dimensioned device drawing required at quote request and time of order. See also... Data Sheet 24009 for up to 27mm |
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Download Data Sheet 24008, Rev J |






