High-Frequency Center Probe™ Test Socket for Devices from 14 to 27mm Square

For Test & Dynamic Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM, and Flash Devices.
Any pitch device on 0.40mm to or larger.
Pressure mounting, no soldering required.
4-point crown insures “scrub” on solder balls, raised tip provides “scrub” on pads.
Signal path during test only 0.077 [1.95]
Accommodates any package up to 27mm square
Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.

Molded Socket Components UL 94 V-0 PEEK and/or Ultem
Pin Inductance 0.51nH (large probe)
Contact Resistance <40 mOhms
1dB Bandwidth to 10.1GHz (0.80mm pitch) (large probe)
Estimated Contact Life 500,000 Cycles
Compression Spring Probes are Heat-treated Beryllium-Copper alloy with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
Contact Force 16g/contact on 0.40mm Pitch 25g/contact on 0.50-0.75mm Pitch 25g/contact on 0.80mm Pitch or larger
Operating Temperature -55°C min. to 150°C max. [-67°F min. to 302°F max.]
All Hardware Stainless Steel

Socket is mounted with four #4-40 screws (to be removed at time socket is mounted to PCB) or a tapped, insulated backing plate to be used on underside of PCB for high pin count applications.
Sockets must be handled with care when mounting or removing sockets to/from PCB.
Test Board PCB diameter 0.025 [0.635] (large probe 0.80mm pitch or larger) 0.015 [0.381] (small probe 0.50-0.75mm pitch) 0.012 [0.300] (small probe 0.40mm pitch)

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET A “INSTA-QUOTE” See also... Data Sheet 24008 for up to 13mm Data Sheet 24011 for up to 40mm Data Sheet 24012 for up to 50mm