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Machined High-Frequency Center Probe™ Test Socket for BGA, CSP, & MLF Packages

Chinese

CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.FEATURES

• Solderless spring probes pressure mount to the test board and device solder ball or pad
• Only 0.077 [1.96] signal path
• Very low inductance and capacitance
• Small footprint allows max. use of test board area
• Chip guides allow accurate device location
• Spring loaded contacts provide high cycle life
• 4-point edge male contacts provide accurate mating
• Socket locating posts provide accurate socket location to board
• Bottom contact allows for via in center of PCB pad
• Available in pitch sizes from 0.30mm and above

GENERAL SPECIFICATIONS

• SOCKET BODY MATERIAL: Torlon PAI
• HARDWARE: Stainless Steel
• SPRING-LOADED CONTACTS: Au-plated BeCu
• CONTACT RESISTANCE: <40 mΩ
• ACCEPTS SOLDER BALL SIZES: 0.15mm-0.93mm
• ESTIMATED CONTACT LIFE: 500,000 cycles
• CONTACT FORCE:
  : 15g per contact on 0.30-0.35mm pitch
  : 16g per contact on 0.40-0.45mm pitch
  : 25g per contact on 0.50-0.75mm pitch
  : 25g per contact on 0.80mm pitch or larger
• PROBE SELF INDUCTANCE: 0.51nH (large probe); 0.59nH (small probe)
• INSERTION LOSS: 1dB to 10.1GHz (larger probe @ 0.80mm pitch); 1dB to 18.7GHz (smaller probe @ 0.50mm pitch)

MOUNTING CONSIDERATIONS

• SUGGESTED LOCATING PIN HOLE SIZE: 0.063 [1.6mm] 2 places
• SUGGESTED MOUNTING HOLE SIZE: 0.120 [3.05mm] 4 places for #4-40 screws
• TEST PCB DIA. "G": 0.025 [0.64] (large probe 0.80mm pitch and larger)
  : 0.015 [0.38] (small probe 0.50-0.75mm pitch)
  : 0.012 [0.31] (small probe 0.40-0.45mm pitch)
  : 0.009 [0.23] (small probe 0.30-0.35mm pitch)
• TEST PCB DIA. SPRING PROBE PAD PLATING: 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ [0.75µ] min. Ni per SEA AMS-QQ-N-290. Pad must be the same height as top surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of your order for your specific application.

TEST REPORTS

Select Test Report... 0.50mm Center Probe™ Test Contact 0.50mm Center Probe™ Test Contact Return Loss Graph 0.80mm Center Probe™ Test Contact 0.80mm Center Probe™ Test Contact Return Loss Graph Center Probe™ CSP DC Measurements w/Cycling Center Probe™ CSP RF Measurements w/Cycling Center Probe™ CSP DC Measurements w/o Cycling Center Probe™ CSP RF Measurements w/o Cycling

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCHES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET A “INSTA-QUOTE”     Also See Data Sheets...   23021 µBGA up to 6.5mm   23017 µBGA up to 13mm   23018 µBGA up to 27mm   23018-APP w/Adj Pressure Pad   23019 µBGA up to 40mm   23020 µBGA up to 55mm   24013 RF up to 6.5mm   24008 RF up to 13mm   24009 RF up to 27mm   24011 RF up to 40mm   24012 RF up to 55mm   23016 CSP/BallNest™ Hybrid   24010 RF Machined Socket   23022 Kelvin Test Socket

“-24HL” HINGED LID VERSION SHOWN	“-24DL” DOUBLE-LATCHED REMOVABLE LID VERSION SHOWN
“-24HL” HINGED LID VERSION SECTION

 

Download Data Sheet 24010, Rev AA