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Machined High-Frequency Center Probe™ Test Socket for BGA, CSP, & MLF Packages

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

• Solderless spring probes pressure mount to the test board and device solder ball or pad
• Only 0.077 [1.96] signal path
• Very low inductance and capacitance
• Small footprint allows maximum use of test board area
• Chip guides allow accurate device location
• Spring loaded contacts provide high cycle life
• Socket locating posts provide accurate socket location to board
• Bottom contact allows for via in center of PCB pad
• Available in pitch sizes from 0.30mm and above

SPECIFICATIONS

• Socket Body Material: Torlon PAI
• Hardware: Stainless Steel
• Spring Loaded Contacts: Gold Plated Beryllium-Copper
• Contact Resistance: <40 milliohm
• Accepts Solder Ball Sizes: 0.15mm-0.93mm
• 4-point Edge Male Contacts provide accurate mating
• Estimated Contact Life: 500,000 cycles
• Contact Force :
  15g per contact on 0.30-0.35mm pitch
  16g per contact on 0.40-0.45mm pitch
  25g per contact on 0.50-0.75mm pitch
  25g per contact on 0.80mm pitch or larger
• Probe Self Inductance: 0.51nH (large probe); 0.59nH (small probe)
• Insertion Loss: 1dB to 10.1GHz (larger probe @ 0.80mm pitch); 1dB to 18.7Ghz (smaller probe @ 0.50mm pitch)

MOUNTING CONSIDERATIONS

• Suggested Locating Pin Hole Size: 0.063 [1.6mm] 2 places
• Suggested Mounting Hole Size: 0.120 [3.05mm] 4 places for #4-40 screws
• Test PCB Diameter “P” :
  0.025 [0.64] (large probe 0.80mm pitch and larger)
  0.015 [0.38] (small probe 0.50-0.75mm pitch)
  0.012 [0.31] (small probe 0.40-0.45mm pitch)
  0.009 [0.23] (small probe 0.30-0.35mm pitch)

TEST REPORTS

Select Test Report... 0.50mm Center Probe™ Test Contact 0.50mm Center Probe™ Test Contact Return Loss Graph 0.80mm Center Probe™ Test Contact 0.80mm Center Probe™ Test Contact Return Loss Graph Center Probe™ CSP DC Measurements w/Cycling Center Probe™ CSP RF Measurements w/Cycling Center Probe™ CSP DC Measurements w/o Cycling Center Probe™ CSP RF Measurements w/o Cycling window:New">Kapton QFP RF Measurements w/o Cycling

 

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET A “INSTA-QUOTE”     See Also Data Sheet...   23021  µBGA up to 6.5mm   23017  µBGA up to 13mm   23018  µBGA up to 27mm   23019  µBGA up to 40mm   23020  µBGA up to 55mm   24013  RF up to 6.5mm   24008  RF up to 13mm   24009  RF up to 27mm   24011  RF up to 40mm   24012  RF up to 55mm   23016  CSP/BallNest Hybrid   23022  Kelvin Test Socket

 

“-24HL” HINGED LID VERSION SHOWN	“-24DL” DOUBLE-LATCHED REMOVABLE LID VERSION SHOWN
“-24HL” HINGED LID VERSION SECTION

 

Download Data Sheet 24010, Rev H