High-Frequency Center Probe™ Test Socket for Devices up to 40mm Square

For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices.
Any pitch device on 0.40mm or larger.
4-point Crown insures “scrub” on solder oxides.
Single-point Probes available for small land area contact pads.
Signal path during test-only 0.077 [1.92]
Socket is easily mounted and removed to and from the Burn-in Board (BIB) with Solderless Pressure-mount Compression Spring Probes, accurately located with two molded plastic Alignment Pins and mounted with four Stainless Steel screws.
Gold over Nickel-plated Compression Spring Probes leave small witness marks on the device’s solder balls.
Standard molded socket format can accommodate any device package of 40mm or smaller.
Pressure Pad Compression Spring provides proper force against device and allows for height variations in device thickness.

Molded Socket Components UL 94 V-0 PEEK and/or Ultem
1dB Bandwidth at 1GHz 0.80mm pitch) (large probe)
Estimated Contact Life 500,000 Cycles
Compression Spring Probes Heat-treated Beryllium-Copper alloy with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
Contact Force 16g/contact on 0.40mm pitch; 25g/contact on 0.50mm-0.75mm and 0.80mm pitch or larger
Operating Temperature -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.)
All Hardware is Stainless Steel
Typical Burn-in Temperature 150°C maximum

See “PCB FOOTPRINT TOP VIEW” for requirements.
Sockets must be handled with care when mounting or removing sockets to/from PCB.
Test Board PCB diameter 0.025 [0.635] (Large Probe 0.80mm Pitch and Larger) 0.015 [0.381] (Small Probe 0.50-0.75mm Pitch) 0.012 [0.300] (Small Probe 0.40mm Pitch)

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCES [MILLIMETERS] CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Consult Factory or... GET AN “INSTA-QUOTE”