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High-Frequency Center Probe™ Test Socket for Devices up to 55mm Square

High-Frequency Center Probe Test Socket for Devices up to 55mm Square

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE. FEATURES

  • For High-frequency Test of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash Devices.
  • Any device on 0.50mm pitch or larger.
  • 4 Point crown insures “scrub” on solder oxides, while pointed probe works with LGA’s, MLF’s, etc.
  • Single Point Probes available for small land area contact pads.
  • Signal path during test only 0.077" [1.95mm]
  • Socket is easily mounted and removed to & from the test board due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four Stainless Steel screws.
  • The Gold over Nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls.
  • Standard molded socket format can accommodate any device package of 55mm square or smaller.
  • The spring loaded, cam actuated Pressure Pad applies proper force against the device after the lid is closed, latched and the cam is rotated to it’s detented location. Reversing the cam removes the force applied to the device prior to unlatching the spring loaded lid to it’s upright position.

GENERAL SPECIFICATIONS

  • Mutual Capacitance 0.012pF
  • Molded Socket Components UL 94 V-0 PEEK and/or Ultem
  • 1dB Bandwidth to 18.5GHz (0.50mm Pitch) (small probe) <3dB to 39.7GHz
  • Pin Self-inductance 0.59nH
  • Contact Resistance <40 mOhms
  • Estimated Contact Life 500,000 Cycles
  • Compression Spring Probes Heat-treated Beryllium-Copper alloy with 30µ min. [0.75µ] Gold per Mil-G-45204 over 30µ min. [0.75µ] Nickel per SAE-AMS-QQ-N-290
  • Contact Force 16g/contact on 0.40mm Pitch 25g/contact on 0.50-0.75mm Pitch  25g/contact on 0.80mm Pitch or larger
  • Operating Temperature -55°C min. to 150°C max. [-67°F min. to 302°F max.]
  • All Hardware Stainless Steel

MOUNTING CONSIDERATIONS

  • See “PCB FOOTPRINT TOP VIEW” for requirements.
  • Sockets must be handled with care when mounting or removing sockets to/from PCB.
  • Test Board PCB Pad diameter 0.025 [0.635] (larger probe = 0.80mm Pitch or larger 0.015 [0.381] (small probe 0.50mm-0.75mm Pitch) 0.012 [0.300] (small probe = 0.40mm Pitch)

TEST REPORTS

 

NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

  

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See also...
Data Sheet 24008 for up to 13mm
Data Sheet 24009 for up to 27mm
Data Sheet 24010 for up to 40mm

 

Reference-Only Drawing for High-Frequency Center Probe Test Socket for Devices up to 55mm Square
Spring Probe Contacts for High-Frequency Center Probe Test Socket for Devices up to 55mm Square

 

Download Data Sheet 24012 , Rev E