Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square

High-Frequency Center Probe Test Socket for Devices up to 6.5mm Sq.

ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATION CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATION WITHOUT NOTICE.
FEATURES

  • For test & dynamic burn-in of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices
  • Any pitch device on 0.30mm pitch or higher
  • Socket is easily mounted and removed to & from the PCB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with two stainless steel screws
  • The gold over nickel-plated compression spring probes leave very small witness marks on the bottom surface of the device solder balls
  • Standard molded socket format can accommodate any device package of 6.5mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers
  • Pressure pad compression spring provides proper force against device and allows for height variations in device thickness
  • 4-point crown insures “scrub” on solder balls, and raised tip probe provides “scrub” on pads
  • Signal path during test only 0.077 [1.96]

SPECIFICATIONS

  • 1dB Bandwidth at 18.5GHz, <3dB to 39.7GHz (0.50mm pitch)
  • Pin Inductance: 0.59nH (@ 0.50mm pitch)
  • Mutual Capacitance: 0.12pF
  • VSWR: <2:1 to 38GHz
  • Contact Resistance: <40 milliohms
  • Compression Spring Probes: heat-treated Beryllium-Copper
  • Compression Spring Probe Plating: 30μ min. [0.75μ] Gold per Mil-G-45204 over 30μ min. [0.75μ] Nickel per SAE-AMS-QQ-N-290
    • Estimated Contact Life: 500,000 cycles minimum
  • Contact Force :
    15g per contact on 0.30-0.35mm pitch
    16g per contact on 0.40-0.45mm pitch
    25g per contact on 0.50-0.75mm pitch
    25g per contact on 0.80mm pitch or larger
  • Operating Temperature: -55°C (min.) to 150°C (max.) [-67°F to 302°C]
  • Molded Socket Components: UL94V-0 Ultem

MOUNTING CONSIDERATIONS

  • See “PCB FOOTPRINT TOP VIEW” for requirements
  • Requires two (2) #0-80 screws (supplied) and PEM nuts for mounting (not supplied). Mounting holes size shown may differ depending on PEM nut selected
  • Sockets must be handled with care when mounting or removing sockets to/from PCB to avoid damaging spring contacts.
  • Test PCB Diameter “P” :
    0.025 [0.64] (large probe 0.80mm pitch and larger)
    0.015 [0.38] (small probe 0.50-0.75mm pitch)
    0.012 [0.31] (small probe 0.40-0.45mm pitch)
    0.009 [0.23] (small probe 0.30-0.35mm pitch)

TEST REPORTS

 

NOTICE   ORDERING INFORMATION

RoHS-compliantALL DIMENSIONS IN INCES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

DETAILED DEVICE DRAWING MUST BE SENT TO ARIES TO QUOTE AND DESIGN A SOCKET

FACTORY WILL SUPPLY SOCKET DRAWING WITH A-H DIMENSIONS. LEGIBLE DIMENSIONED DEVICE DRAWING REQUIRED AT QUOTE REQUEST AND TIME OF ORDER

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

 

Consult Factory or...

GET AN “INSTA-QUOTE”

 

See Also Data Sheet...
  23021  µBGA up to 6.5mm
  23017  µBGA up to 13mm
  23018  µBGA up to 27mm
  23019  µBGA up to 40mm
  23020  µBGA up to 55mm
  24008  RF up to 13mm
  24009  RF up to 27mm
  24011  RF up to 40mm
  24012  RF up to 55mm
  23016  CSP/BallNest Hybrid
  23022  Kelvin Test Socket
  24010  RF Machined Socket

 

Reference-Only Drawing for High-Frequency Center Probe Test Socket for Devices up to 6.5mm Sq.
High-Frequency Center Probes for Test Sockets

 

Download Data Sheet 24013, Rev B