Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

ARIES ELECTRONICS ANNOUNCES NEW THERMAL SOLUTIONS FOR ITS TEST AND BURN-IN SOCKET LINE

 Thyermal AnalysisBristol, PA – April 13, 2015 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products, burn-in and test IC sockets, and adapters used worldwide, announced the introduction of its new thermal profiling solution for its test and burn-in socket line of products.

Aries' thermal profile solutions go beyond standard heat-sink and fan options offered by others. This solution incorporates advanced thermal profiling software to develop an application/IC specific thermal analysis for each customer's requirement(s).

This software will analyze all of the necessary parameters within the socket/IC/test environment and determine the correct heat sink/fan/cooling combination necessary to optimize the test and burn-in application. This enables the socket to be thermally correct before it is placed into its final environment saving Aries' customers time and money.

New thermal profiles are initiated using an online fill-in form linked from all of Aries' test and burn-in socket pages.

For additional information, contact Paul Ruo, Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810 Tel 215-781-9956 Email: paulruo@arieselec.com


ARIES ELECTRONICS ANNOUNCES NEW LOW-COST, QUICK-DELIVERY, CORRECT-A-CHIP® IC ADAPTERS

 NEW LOW-COST, QUICK-DELIVERY, CORRECT-A-CHIP IC ADAPTERSBristol, PA – August 13, 2014 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products, Burn-in and Test IC Sockets AND Adapters used worldwide, announced the introduction of a new line of low-cost, quick-turn, Correct-A-Chip® IC Adapters for common IC devices.

These adapters enable the user to transform (or adapt) standard SOIC, MSOP, TSSOP or QFP packages into standard thru-hole DIP configurations for breadboarding and prototyping use.

Unlike the standard Aries Correct-A-Chip® Adapters, these new items are designed for VERY quick delivery and low cost. The adapters are fabricated from a 0.062" thick, FR-4, with ½-oz Cu traces. The pins are made from a Au-plated brass and are designed for operating temperatures of -55°C to +125°C.

See Data Sheets...

The quick delivery on all items is ensured by a special stocking program in association with Future Electronics, DigiKey Corporation, and Mouser Electronics. All part numbers are continually available off-the-shelf at these authorized distributors for next-day delivery (if desired).

Industry-leading products include... Zero-Insertion-Force (ZIF) Test Sockets for DIP, PGA, BGA, QFN, QFP and SOIC devices; the "Intelligent" Correct-A-Chip® product line; adapters and connectors; several patented concepts for BGA (Ball Grid Array) and LGA (Land Grid Array) sockets; and an extensive array of High-Frequency Test and Burn-in Sockets. The company also specializes in meeting custom requirements for its customers.

For additional information, contact Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810; Tel: +1-215-781-9956; Email: info@arieselec.com


 

Aries Electronics Announces Protect-A-Probe™ Anti-Diffusion Gold Coating
Now Available for All Spring-Probes

 Aries Electronics Announces Protect-A-Probe™ Anti-Diffusion Gold Coating Now Available for All Spring-ProbesBristol, PA – March 10, 2014 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products, burn-in and test sockets used worldwide, announced today at the BiTS Conference Workshop in Mesa, AZ, the introduction of its unique Protect-A-Probe™ anti-diffusion, gold coating for its complete line of burn-in and test socket spring-probes.

The Protect-A Probe™ coating is designed to lessen or eliminate the need for probe cleaning, by applying its proprietary, anti-diffusion, gold coating onto the probe before assembly. This coating, once applied, acts like a “Teflon” barrier preventing solder and other debris from adhering to the probe tip. This lessens (or eliminates) cleaning, which reduces downtime and increases throughput!

When used in HAST, HTOL or standard burn-in applications this can prevent the IC solder balls/bumps from “sticking” to the probe causing damage to the IC and/or socket. When used in test (including RF testing) applications, a probe that stays cleaner, longer, will yield more consistent contact resistance (CRes) readings over a longer period of time. This saves time and money.

This coating has been tested in a socket with an IC which had SAC405 balls on 0.35mm pitch for over 1500 hours at 150°C. No debris or IC or socket damage was noticed.

This coating is now available for the Aries’ complete line of spring-probe, standard and custom Test and Burn-in Sockets as well as the complete line of spring-probe based RF Test Sockets.

For additional information, contact Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810; Tel: +1-215-781-9956; Email: info@arieselec.com


 

Aries Electronics Announces Probes on 0.2mm Pitch

  0.2mm ProbesBristol, PA – October 2013 – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products and test sockets used worldwide, announces its latest addition to its socket spring-probe repertoire with new probes capable of contacting devices on 0.2mm pitch.

These new probes enable socketing (for test and burn-in applications) for many new device packages and bare-die being designed and made on this pitch. The contact and spring material are gold-plated Beryllium-Copper. The probes are available with either a pointed–tip or crown-shaped termination.

These new probes will yield >100k cycles over a temperature range of -55°C to +150°C. This performance makes these probes ideal for socketing for bench test or burn-in applications. In addition, these probes yield a very low inductance (~0.59nH) signal path making them compatible with testing RF devices at 10GHz and beyond. They require about 6g of compression to actuate and can be placed on a 0.004" diameter PCB pad.

These probes can be used with any of Aries standard molded and machined CSP socket bodies. This enables the customer to use this socket on any new or previously existing test (or burn-in) board. (See product overview)

For additional information, contact Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810; Tel: +1-215-781-9956; Email: info@arieselec.com


 

Kelvin Testing May Solve Socket Downtime Problems

by Paul Ruo in Test, Assembly & Packaging Times (TAP)

Paul Ruo

What do you do when normal spring-probe or other socket technology leaves your
low-resistance or high-accuracy voltage with less than stellar results?
Read More

Kelvin Spring-Probe Cross-section

 


 

Aries Electronics Awarded “Best Presentation, Tutorial in Nature” at BiTS 2013

  Paul Ruo of Aries Electronics Awarded “Best Presentation – Tutorial in Nature” at BiTS Workshop ConferenceBRISTOL, PA – Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products – burn-in and test sockets used worldwide, was awarded “Best Presentation – Tutorial in Nature” for the paper entitled “Anatomy of a Test Socket” which was authored and presented by Paul Ruo (VP Sales and Marketing) at the annual Burn-in & Test Strategies Workshop (BiTS), held March 3-8 in Mesa, Arizona.

The presentation focused on the components and construction of burn-in and test sockets from concept through assembly. It was produced to help educate those in associated industries who may lack an appreciation for all the steps and intricacies necessary to manufacture a burn-in or test socket.

Suppliers and burn-in and test socket users from all over the world gather each year at the annual BiTS Expo to share what is Now & Next in burn-in and test tooling products and services.

Pictured during the award presentation ceremony are (left to right); Fred Tabor, Chairman of BiTS Workshop, Paul Ruo, VP Sales and Marketing, Aries Electronics and Mike Noel, BiTS Committee Member. See presentation here.

For additional information, contact Aries Electronics, Inc., 2609 Bartram Road, Bristol, PA 19007-6810; Tel: +1-215-781-9956; Email: info@arieselec.com

EDITOR'S NOTE: From its Bristol, PA facility, Aries Electronics, Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products used worldwide for a variety of electronics applications.

Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, BGA, QFN, QFP and SOIC devices; the “intelligent” Correct-A-Chip® product line; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.