Search by P/N

Search Parts by KEYWORD Any search words All search words

Get PRICING by P/N

Check INVENTORY by P/N

Download Our Web Guide for Quick Answers

Last Update:

News / Media

New RoHS-Compliant Programmable Headers and Covers by Aries Electronics Eliminate the Need for DIP Switches

 FRENCHTOWN, N.J., October 2007 – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers RoHS-compliant programmable headers and covers that eliminate the need for DIP switches in many situations.

The versatile Series 680 is available either pre-programmed from Aries Electronics or users can program the headers and covers themselves by using programming tools, such as Aries’ T-680, which offers on-the-spot programming.

These headers and covers, constructed of durable black UL 94V-0 glass filled 4/6 Nylon, are available with either plain (solid) or top-slot press-on covers. The plain covers protect the programs while the top-slot covers allow programming of opposing pins through square openings on top.

The Series 680 features sturdy 3/4-hard brass alloy pins, as well as tin pin plating. The tin plated headers and covers offer a 50-150μ" minimum matte tin per ASTM B545-97 over a 50μ" nickel plating per SAE-AMS-QQ-N-290.

With a current rating of 1 amp, the Series 680 has an operating temperature of 221°F [105°C]. In addition, the headers and covers can be easily mounted in a PCB hole size of 0.032" ±0.002" [0.81mm ±0.05mm] in diameter.

Pricing for 1,000 pieces of a 16-pin 680 type programmable header is $0.66 each, price for 1,000 pieces of a 16-pin header cover is $0.25 each. Lead time stock to 2 weeks.

 

Select Previous Press Release... 2007 Oct – New RoHS-Compliant Programmable Headers and Covers Eliminate Need for DIP Switches 2007 Sep – New ‘Ordering Information’ Section Offers Immediate Pricing and Stock Availability 2007 Aug – Flat Pin Staked Flex Jumpers Introduced to Line of RoHS-Compliant Components 2007 Aug – New Web Guide Features Product Overview in Roster Format Complete with Data Sheet URL 2007 Jul – Now Provides RoHS-Compliant Sockets for High Pin Count and Non-Standard Components 2007 Jun – Adds Display Sockets to Increasing Number of RoHS-Compliant Components 2007 May – All Universal ZIF Test Sockets Now RoHS-Compliant 2007 Apr – New RF Sockets Accept Devices with Pitches as Low as 0.40mm 2007 Mar – New Low-Cost, RoHS-Compliant Correct-A-Chip™ Adaptors 2007 Feb – RoHS-Compliant SSOP Adaptors Allow Users to Determine Size 2006 Dec – RoHS-Compliant PLCC-to-DIP Adaptors 2006 Nov – RoHS-Compliant SOWIC-to-DIP Adaptors 2006 Oct – CSP Test & Burn-in Socket for Devices 28-40mm Sq 2006 Aug – Lead-Free BGA-to-Tin/Lead BGA Adaptors 2006 May – RoHS-Compliant PLCC-to-DIP Adaptors 2006 Mar – CanaREP to Represent Connector Products in Canada 2006 Feb – RoHS-Compliant SOIC-to-DIP Adaptor 2006 Jan – PinBall™ Socket for 0.50mm to 0.80mm Pitch 2005 Nov – Dynamic Burn-in Socket for Packages up to 13mm Sq 2005 Oct – 12-Ball µBGA-to-14-Pin DIP 2005 Sep – Correct-A-Chip™ Adaptors Allow SOIC Interchange 2005 Aug – 30% Greater Bandwidth for Center Probe™ Test Sockets 2005 Jun – CSP Test & Burn-in Socket for 14-55mm Sq Pkgs 2005 May – 160-Pin QFP Correct-A-Chip™ Adaptor 2005 Apr – Center Probe™ RF Test Socket for Delta Handlers 2005 Jan – TQFP-to-PQFP Adaptor for Board Upgrade w/o Rework 2004 Dec – Solderable Center Probe™ Socket for Pkg Debugging 2004 Dec – Pin-for-Pin Replacement for Obsolete Aromat Relay 2004 Nov – Shortform Catalog 2004 Nov – 68-Pin PLCC-to-PGA Correct-A-Chip™ Adaptor 2004 Sep – RF Center Probe™ Test Socket for 28-55mm Sq Pkgs 2004 Jul – CSP/µBGA Test & Burn-in Socket for 55mm Sq Pkgs 2004 Apr – SOIC Adaptor for Upgrades from Older Relays 2004 Mar – Adaptor Enables Replacement of PLCC-to-SOJ and SOIC 2003 Oct – RF Center Probe™ Test Socket for 14-27mm Sq Devices 2003 Sep – CSP/µBGA Test & Burn-in Socket for 14-27mm Sq Under 1GHz 2003 Aug – DSC Component Sales Rep Connector Products in Wisconsin 2003 Aug – High-Frequency Test Socket for 13mm Sq at 1-10GHz 2003 Aug – RF Center Probe™ Test Socket w/Floating Guide Plate 2003 Jul – Component Technology to Rep in Southern States 2003 Jul – CSP/µBGA Test & Burn-in Socket for 13mm Sq Pkg at 1GHz 2003 May – Online Insta-Quote System Reduces Lead Times 2003 Apr – Side-Stackable BGA Socket Improve Packaging Density 2002 Oct – Altanova & Aries Partner for Total Semiconductor Testing 2002 Oct – Cam Lid for High-Frequency Test Sockets Eliminates Damage 2002 Sep – SSOP-to-SOWIC Correct-A-Chip™ Adaptors 28-Pin Version 2002 Aug – New Shortform Catalog 2002 Jul – High-Temp Lead-Free SOIC-to-DIP Correct-A-Chip™ Adaptor 2002 Apr – Ohmage Technologies to Rep Network for Eastern Canada 2002 Apr – Anti-Static Version of Low-Cost DIP Pin Straightener 2002 Feb – BGA Circuit Bridge Adaptor for Testing & Upgrading 2001 Dec – 1.00mm & 1.27mm Pitch BGA Sockets & Adaptors 2001 Nov – RF Test Sockets w/Spring-Loaded Lids 2001 Oct – High-Performance RF Test Socket for Multitest 9510 Handler 2001 Sep – Elevator Display Sockets w/Bifurcated Contacts 2001 Aug – MLF-Compatible RF Test Sockets for High-Speed Apps 2001 Aug – Website Expanded to Include “Check Stock" Feature 2001 Aug – RF Test Sockets w/Replaceable Microstrip™ Contacts 2001 Jul – Programmable Headers Alternative to DIP Switches 2001 Jul – Expanded Range of Shorting Plugs & Jacks 2001 May – 1.0mm Pitch BGA/CSP Hybrid Socket 2001 May – DIP-to-0.100" Flexible Jumpers 2001 Mar – Online Expansion of RF Test Sockets 2001 Mar – BGA Test Socket for Mobile Pentium III® 2001 Feb – Seiko-Hummingbird 3500 & 5500 Handlers Test Socket 2000 Dec – PGA ZIF Test Socket Line Expanded 2000 Nov – Display Socket Line Expanded 2000 Oct – 64-Pin 0.5mm TQFP-to-0.8mm QFP Conversions Adaptors 2000 Jul – SSOP-to-SOWIC Correct-A-Chip™ Adaptors 2000 May – RF Test Socket for 0.4mm Lead Pitch 2000 Apr – RF 3910 Test Socket 1999 Dec – High-Frequency, Low-Inductance Test Socket for Aetrium 5050T Handler 1999 Jun – Program-Your-Own Adaptors 1999 Jun – PLCC ZIF Sockets for Flat Pack Ceramic Pkgs 1999 Apr – Custom Adaptors Converts Any Device to BGA 1999 Mar – Temp Range Expanded for Display Sockets 1999 Feb – High-Performance RF Test Sockets Featured 1999 Jan – Temp Range Expanded for Display Sockets 1998 Nov – Adaptors for Intel and Other DIP Devices with PLCC Sockets 1998 Sep – Flat Pin-Staked Flex Jumpers w/Kapton® Insulation 1998 Jul – Reduce Solder Ball Deformation 1998 Apr – High-Temp Universal ZIF DIP Test Sockets 1998 Mar – Improved High-Frequency RF Test Sockets 1998 Mar – Expanded Shortform Catalog 1998 Jan – 90-Degree Flex Jumpers 1997 Dec – Expanded Vertisocket™ Line 1997 Oct – Alternative to Solder Balls for BGAs