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Aries Electronics Relocates Corporate Headquarters to Expanded Facility

 BRISTOL, PA, January 2008 – Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has relocated its corporate headquarters to a new 50,000-square-foot facility in Bristol, PA.

Bill Sinclair, president and CEO of Aries Electronics, said, “Our expanded facility provides us with greater production and engineering capabilities. It will also enable us to increase product offerings to our customers. We expanded in response to the continual growth in demand for our products, both here and abroad. Most importantly, this new facility enables Aries to remain a U.S. manufacturing company, ensuring optimum quality control and cost-effective products.”

The new headquarters is more than double the size of Aries’ previous location. This new facility allows the company to continue expanding its broad range of custom and standard interconnection and packaging products for electronics.

Effective January 1, 2008, Aries' new address is 2609 Bartram Road; Bristol, PA 19007-6810. Telephone and fax have changed to (215) 781-9956 (phone), (215) 781-9845 (fax). Emails remain the same: Email: info@arieselec.com; Europe Email: europe@arieselec.com

 

Select Previous Press Release... 2008 Jan – Aries Electronics Relocates Corporate Headquarters to Expanded Facility 2007 Oct – New RoHS-Compliant Programmable Headers and Covers Eliminate Need for DIP Switches 2007 Sep – New ‘Ordering Information’ Section on Aries’ Website Offers Immediate Pricing and Stock Availability 2007 Aug – Flat Pin Staked Flex Jumpers Introduced to Line of RoHS-Compliant Components 2007 Aug – New Web Guide Features Product Overview in Roster Format Complete with Data Sheet URL 2007 Jul – Now Provides RoHS-Compliant Sockets for High Pin Count and Non-Standard Components 2007 Jun – Adds Display Sockets to Increasing Number of RoHS=Compliant Components 2007 May – All Universal ZIF Test Sockets Now RoHS-Compliant 2007 Apr – New RF Sockets Accept Devices with Pitches as Low as 0.40mm 2007 Mar – New Low-Cost, RoHS-Compliant Correct-A-Chip™ Adaptors Available from Aries Electronics 2007 Feb – Aries Electronics Revamps Website to Further Assist Design Engineers 2007 Feb – RoHS-Compliant SSOP Adaptors Allow Users to Determine Size 2006 Dec – RoHS-Compliant PLCC-to-DIP Adaptors 2006 Nov – RoHS-Compliant SOWIC-to-DIP Adaptors 2006 Oct – CSP Test & Burn-in Socket for Devices 28-40mm Sq 2006 Aug – Lead-Free BGA-to-Tin/Lead BGA Adaptors 2006 May – RoHS-Compliant PLCC-to-DIP Adaptors 2006 Mar – CanaREP to Represent Connector Products in Canada 2006 Feb – RoHS-Compliant SOIC-to-DIP Adaptor 2006 Jan – PinBall™ Socket for 0.50mm to 0.80mm Pitch 2005 Nov – Dynamic Burn-in Socket for Packages up to 13mm Sq 2005 Oct – 12-Ball µBGA-to-14-Pin DIP 2005 Sep – Correct-A-Chip™ Adaptors Allow SOIC Interchange 2005 Aug – 30% Greater Bandwidth for Center Probe™ Test Sockets 2005 Jun – CSP Test & Burn-in Socket for 14-55mm Sq Pkgs 2005 May – 160-Pin QFP Correct-A-Chip™ Adaptor 2005 Apr – Center Probe™ RF Test Socket for Delta Handlers 2005 Jan – TQFP-to-PQFP Adaptor for Board Upgrade w/o Rework 2004 Dec – Solderable Center Probe™ Socket for Pkg Debugging 2004 Dec – Pin-for-Pin Replacement for Obsolete Aromat Relay 2004 Nov – Shortform Catalog 2004 Nov – 68-Pin PLCC-to-PGA Correct-A-Chip™ Adaptor 2004 Sep – RF Center Probe™ Test Socket for 28-55mm Sq Pkgs 2004 Jul – CSP/µBGA Test & Burn-in Socket for 55mm Sq Pkgs 2004 Apr – SOIC Adaptor for Upgrades from Older Relays 2004 Mar – Adaptor Enables Replacement of PLCC-to-SOJ and SOIC 2003 Oct – RF Center Probe™ Test Socket for 14-27mm Sq Devices 2003 Sep – CSP/µBGA Test & Burn-in Socket for 14-27mm Sq Under 1GHz 2003 Aug – DSC Component Sales Rep Connector Products in Wisconsin 2003 Aug – High-Frequency Test Socket for 13mm Sq at 1-10GHz 2003 Aug – RF Center Probe™ Test Socket w/Floating Guide Plate 2003 Jul – Component Technology to Rep in Southern States 2003 Jul – CSP/µBGA Test & Burn-in Socket for 13mm Sq Pkg at 1GHz 2003 May – Online Insta-Quote System Reduces Lead Times 2003 Apr – Side-Stackable BGA Socket Improve Packaging Density 2002 Oct – Altanova & Aries Partner for Total Semiconductor Testing 2002 Oct – Cam Lid for High-Frequency Test Sockets Eliminates Damage 2002 Sep – SSOP-to-SOWIC Correct-A-Chip™ Adaptors 28-Pin Version 2002 Aug – New Shortform Catalog 2002 Jul – High-Temp Lead-Free SOIC-to-DIP Correct-A-Chip™ Adaptor 2002 Apr – Ohmage Technologies to Rep Network for Eastern Canada 2002 Apr – Anti-Static Version of Low-Cost DIP Pin Straightener 2002 Feb – BGA Circuit Bridge Adaptor for Testing & Upgrading 2001 Dec – 1.00mm & 1.27mm Pitch BGA Sockets & Adaptors 2001 Nov – RF Test Sockets w/Spring-Loaded Lids 2001 Oct – High-Performance RF Test Socket for Multitest 9510 Handler 2001 Sep – Elevator Display Sockets w/Bifurcated Contacts 2001 Aug – MLF-Compatible RF Test Sockets for High-Speed Apps 2001 Aug – Website Expanded to Include “Check Stock” Feature 2001 Aug – RF Test Sockets w/Replaceable Microstrip™ Contacts 2001 Jul – Programmable Headers Alternative to DIP Switches 2001 Jul – Expanded Range of Shorting Plugs & Jacks 2001 May – 1.0mm Pitch BGA/CSP Hybrid Socket 2001 May – DIP-to-0.100" Flexible Jumpers 2001 Mar – Online Expansion of RF Test Sockets 2001 Mar – BGA Test Socket for Mobile Pentium III® 2001 Feb – Seiko-Hummingbird 3500 & 5500 Handlers Test Socket 2000 Dec – PGA ZIF Test Socket Line Expanded 2000 Nov – Display Socket Line Expanded 2000 Oct – 64-Pin 0.5mm TQFP-to-0.8mm QFP Conversions Adaptors 2000 Jul – SSOP-to-SOWIC Correct-A-Chip™ Adaptors 2000 May – RF Test Socket for 0.4mm Lead Pitch 2000 Apr – RF 3910 Test Socket 1999 Dec – High-Frequency, Low-Inductance Test Socket for Aetrium 5050T Handler 1999 Jun – Program-Your-Own Adaptors 1999 Jun – PLCC ZIF Sockets for Flat Pack Ceramic Pkgs 1999 Apr – Custom Adaptors Converts Any Device to BGA 1999 Mar – Temp Range Expanded for Display Sockets 1999 Feb – High-Performance RF Test Sockets Featured 1999 Jan – Temp Range Expanded for Display Sockets 1998 Nov – Adaptors for Intel and Other DIP Devices with PLCC Sockets 1998 Sep – Flat Pin-Staked Flex Jumpers w/Kapton® Insulation 1998 Jul – Reduce Solder Ball Deformation 1998 Apr – High-Temp Universal ZIF DIP Test Sockets 1998 Mar – Improved High-Frequency RF Test Sockets 1998 Mar – Expanded Shortform Catalog 1998 Jan – 90-Degree Flex Jumpers 1997 Dec – Expanded Vertisocket™ Line 1997 Oct – Alternative to Solder Balls for BGAs