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Burn-in & Test Sockets and Adapters for Devices in...

QFP (Quad Flat Package)
TSSOP (Thin Shrink Small Outline Package)
CSP (Chip Scale Package)
BGA (Ball Grid Array)
QFN (Quad Flat No-Lead Package)
MLF (Micro Lead Frame)

Confused by the different types of sockets?
Unsure which socket is correct for your application?
HERE’S YOUR ANSWER!

  DESCRIPTION
DATA SHEET PDF
CSP/BallNest™ Hybrid Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices
 CSP/BallNest™Hybrid Socket
CSP/µBGA Test & Burn-In Socket for Devices up to 6.5mm Square
CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 13mm Square

CSP/µBGA Test & Burn-In Socket for Dwwevices up to 13mm Square GET AN “INSTA-QUOTE”
CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices 14-27mm Square

CSP/µBGA Test & Burn-In Socket for Devices 14-27mm Square GET AN “INSTA-QUOTE”
CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
 CSP/µBGA Test & Burn-in Socket w/Adjustable Pressure Pad for Devices up to 27mm Square
CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 40mm Square

CSP/µBGA Test & Burn-In Socket for Devices up to 40mm Square GET AN “INSTA-QUOTE”
CSP/µBGA Test & Burn-In Socket for BGA, LGA, QFN, QFP, MLF, LCC & CSP Devices up to 55mm Square

CSP/µBGA Test & Burn-In Socket for Devices up to 55mm Square GET AN “INSTA-QUOTE”
Kelvin Test Socket
23023 Optical Laser Failure Analysis Microscopy for Test Socket
 CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
 Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices