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CUSTOMIZATION: IN ADDITION TO THE STANDARD PRODUCTS SHOWN ON THIS PAGE, ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. NOTE: ARIES RESERVES THE RIGHT TO CHANGE PRODUCT SPECIFICATIONS WITHOUT NOTICE.

24-Pin SOIC-to-22-Pin 0.400" DIP Adapter

FEATURES

• A cost-effective means of upgrading to SOIC without changing your PCB layout.

GENERAL SPECIFICATIONS

• BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides
• PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B
• OPERATING TEMPERATURE: 221ºF [105ºC]

MOUNTING CONSIDERATIONS

• SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71±0.08] dia.

NOTICE		ORDERING INFORMATION
ALL DIMENSIONS IN INCHES [MILLIMETERS] ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED PINS 11 AND 14 NOT CONNECTED ON SOIC CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED		Specify SOIC-to-DIP Adapter Option Panelized Form Version

 

Download Data Sheet 18080, Rev AA