Aries Electronics - Your Best Source for Interconnection and Packaging Solutions

CSP Hybrid Socket

FEATURES

CSP/Ballnest™ Hybrid Socket

CLEANING, HANDLING, MOUNTING
& PROBE REPLACEMENT INFO
 
GENERAL SPECIFICATIONS

MOUNTING CONSIDERATIONS

Need a Breakout Board?

SPECIAL THERMAL REQUIREMENT WORKSHEET

TEST REPORTS

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

CONSULT FACTORY for DIM. “A” - “S”

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

 

Consult Factory

A detailed device drawing must be sent to Aries to quote and design a socket.

Also See Data Sheets for...
CSP Sockets
  23016 Hybrid Socket
  23021 µBGA up to 6.5mm
  23017 µBGA up to 13mm
  23018 µBGA up to 27mm
  23018-APP w/Adj Pressure Pad
  23019 µBGA up to 40mm
  23020 µBGA up to 55mm
  23023 µBGA up to 55mm
  24014 µBGA up to 55mm
RF Sockets
  24013 RF up to 6.5mm
  24008 RF up to 13mm
  24009 RF up to 27mm
  24009-APP - w/Adj Pressure Pad
  24011 RF up to 40mm
  24012 RF up to 55mm
  24010 RF Machined Socket
  23022 Kelvin Test Socket

Reference-Only Drawing for CSP/Ballnest™ Hybrid Socket

FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.

Spring-Probes for CSP/Ballnest Hybrid Socket
Download Data Sheet 23016, Rev 1.6