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CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy*

Available with or without filters for UV, infrared and full spectrum applications, this optical test socket is ideal for testing an optical sensor type chip and for EMMI testing a standard chip using an infrared head sensor. The optical test socket line can accommodate many different optical window and lens materials, including glass, sapphire, and plastic depending on operational requirements. The standard optical grade window on the 23023 socket uses a high-quality quartz V077 glass with a 98% transmission rate from <260nm in the UV to >2000nm in the infrared.

CSP Test Socket for Optical Laser Failure Analysis Microscopy (EMMI)

FEATURES

CLEANING, HANDLING, MOUNTING
& PROBE REPLACEMENT INFO
 
MOUNTING CONSIDERATIONS

Need a Breakout Board?

SPECIAL THERMAL REQUIREMENT WORKSHEET

GENERAL SPECIFICATIONS

  • BODY MATERIAL: Ultem® or Torlon®
  • 1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
  • ESTIMATED CONTACT LIFE: 500,000 cycles
  • COMPRESSION SPRING-PROBES: heat-treated BeCu with 30µ min. [0.75µ] Au per MIL-G-45204 over 30µ min.
    [0.75µ] Ni per SAE AMS-QQ-N-290B
  • CONTACT FORCE...
    : 6g per contact on 0.20-0.29mm pitch
    : 15g per contact on 0.30-0.35mm pitch
    : 16g per contact on 0.40-0.45mm pitch
    : 25g per contact on 0.50-0.75mm pitch
    : 25g per contact on 0.80mm pitch or larger
  • SCREWS, ALIGNMENT PINS: Stainless Steel
  • INSERTS: Brass per QQ-B-626
  • OPERATING TEMPERATURE: -55ºC to 150ºC [-67º to 302º]

* Emission Microscopy (EMMI) is a powerful early-stage noninvasive failure analysis technique localizing failures and requiring little sample preparation. Flip-chip devices, difficult to study by other means, are easily studied through the die without decapsulation and often without thinning, making it an efficient optical analysis technique that will detect and localize certain integrated circuit failures. It can be performed from either the front or back sides of devices.

Image: EMMI images showing light emission from failed devices at several locations (front side top)

Front side (top) – EMMI imagesshowing light emission fromfailed devices at several locations

TEST REPORTS

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS: INCHES [MILLIMETERS]

ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED

CONSULT FACTORY for DIM. “A” - “K”

CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

 

Consult Factory

A detailed device drawing must be sent to Aries to quote and design a socket.

Also See Data Sheets for...

CSP Sockets
  23016 Hybrid Socket
  23021 µBGA up to 6.5mm
  23017 µBGA up to 13mm
  23018 µBGA up to 27mm
  23018-APP w/Adj Pressure Pad
  23019 µBGA up to 40mm
  23020 µBGA up to 55mm
  23023 µBGA up to 55mm
  24014 µBGA up to 55mm
RF Sockets
  24013 RF up to 6.5mm
  24008 RF up to 13mm
  24009 RF up to 27mm
  24009-APP - w/Adj Pressure Pad
  24011 RF up to 40mm
  24012 RF up to 55mm
  24010 RF Machined Socket
  23022 Kelvin Test Socket

Reference-Only Drawing for CSP Test Socket for Optical Laser Failure Analysis Microscopy (EMMI), Dwg 1

FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.

Reference-Only Drawing for CSP Test Socket for Optical Laser Failure Analysis Microscopy (EMMI), Dwg 2

Spring-Probes for CSP Test Socket for Optical Laser Failure Analysis w/Emission Microscopy
Download Data Sheet 23023, Rev 1.6