Aries Electronics - Your Best Source for Interconnection and Packaging Solutions
 

Hi-Temp 200°C High-Frequency Interposer Test & Burn-In Sockets for
BGA, LGA, QFN, MLCC, and Bumped Die Devices

Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

KEY PERFORMANCE ELEMENTS – Series AR4HT

SILMAT® CONTACT TECHNOLOGY

MECHANICAL

ELECTRICAL (0.5mm pitch)

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

 

Consult Factory

This material can be ordered with ANY Aries CSP Sockets

SPECIAL THERMAL REQUIREMENT WORKSHEET

INTERPOSER
Interposer Column Array Interposer Cross-section

Column Array
Elastomer Matrix Compliant Buttons

Cross Section
Ag Particles

Download Data Sheet 23026, Rev 1.5