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Hi-Temp 200°C High-Frequency Interposer Test & Burn-In Sockets for
BGA, LGA, QFN, MLCC, and Bumped Die Devices

Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

KEY PERFORMANCE ELEMENTS – Series AR4HT

SILMAT® CONTACT TECHNOLOGY

MECHANICAL

ELECTRICAL (0.5mm pitch)

NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

 

Consult Factory

This material can be ordered with ANY Aries CSP Sockets

INTERPOSER
Interposer Column Array Interposer Cross-section

Column Array
Elastomer Matrix Compliant Buttons

Cross Section
Ag Particles

Download Data Sheet 23026, Rev 1.5