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High-Temp (up to 200°C) Test & Burn-in Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom-Machined Configuration

High-Temp Test & Burn-in Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices

KEY PERFORMANCE ELEMENTS – Series AR4HT

MECHANICAL

Need a Breakout Board?

SPECIAL THERMAL REQUIREMENT WORKSHEET

ELECTRICAL (0.5mm pitch)

  • BANDWIDTH (frequency response): -1dB at >40GHz
  • SELF-INDUCTANCE: 0.10nH
  • MUTUAL INDUCTANCE: 0.02nH
  • CAPACITANCE TO GROUND: 0.14pF
  • MUTUAL CAPACITANCE: 0.01pF
  • CONTACT RESISTANCE (initial): <25mΩ
  • CURRENT RATING: 4 amps at 14°C heat rise

SILMAT® CONTACT TECHNOLOGY

  • It is NOT a cheap conductive rubber sheet
  • It is NOT a prototype or a copy
  • It IS a cost effective, low profile contact structure engineered with specific materials and features to provide electrical and mechanical advantages for high performance applications
  • It IS an innovative, protected, validated and released product with capacity and quality control available to meet existing and emerging customer needs
INTERPOSER
Interposer Column Array Interposer Cross-section
Column Array
Elastomer Matrix Compliant Buttons
Cross Section
Ag Particles
Hi-Temp 200°C Test & Burn- In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices
NOTICE   ORDERING INFORMATION

ALL DIMENSIONS IN INCHES [MILLIMETERS]

CONSULT FACTORY FOR OTHER SIZES & CONFIGURATIONS

ALL TOLERANCES ±0.005 [±0.13] UNLESS OTHERWISE SPECIFIED

PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED

CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on quantity. NOTE: Aries reserves the right to change product specifications without notice.

 

Consult Factory

This material can be ordered with ANY Aries CSP Sockets

Download Data Sheet 23026HT, Rev 1.6